Monolithic-Wafer-Based Cascade-Actuation XYZ-Microstage With Large Displacement and Low Crosstalk by Integrating an In-Plane Comb-Drive XY-Microstage With Out-of-Plane Al/SiO2 Bimorph Actuators
IF 3.1 3区 工程技术Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
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引用次数: 0
Abstract
This study innovatively proposes and demonstrates a monolithic-wafer-based cascade-actuation XYZ-microstage featuring large displacement strokes and low-crosstalk movements, achieved by integrating an in-plane comb-drive XY-microstage with out-of-plane Al/SiO2 bimorph thermoelectric actuators for the first time. A three-level serial kinematic scheme within a monolithic wafer, i.e., a three-level frame-in-frame structural configuration, is employed to mitigate motion crosstalk across the X-, Y-, and Z-axes. In the in-plane comb-drive XY-microstage, which comprises four actuation units, both decoupling-motion structural design and capacitance-coupling crosstalk constraints are implemented to ensure low-crosstalk movements along the ±X- and ±Y-axes. Four sets of out-of-plane Al/SiO2 bimorph actuators independently actuate the comb-drive XY-microstage along the Z-axis. Additionally, mechanical Si-springs are introduced to facilitate electrical interconnections between the XY-microstage and external pads. This design also overcomes the limitation of out-of-plane stroke space in a monolithic wafer, thereby maximizing the actuation potential to achieve significant out-of-plane displacement. A critical step in the microfabrication process involves the successful creation of high-aspect-ratio silicon combs and Al/SiO2 bimorphs by engineering “step” structures in the handle layer of an SOI wafer, enabling subsequent structure release. Finally, the fabricated monolithic-wafer-based XYZ-microstage can provide large displacements of $92.3~\mu $ m, $78.3~\mu $ m, and $2.0~\mu $ m in the X-, Y-, and Z-directions, respectively. Furthermore, the three-dimensional cascade-actuation configuration within a monolithic wafer is adaptable to various actuation-mode combinations, facilitating multi-degree-of-freedom actuations.[2025-0021]
期刊介绍:
The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.