{"title":"Design and statistical optimization of inlay-knitted joule heating textiles for wearable heat therapy","authors":"Sandeep Kumar Maurya, Shubham Singh, Apurba Das, Bipin Kumar","doi":"10.1007/s10854-025-15876-8","DOIUrl":null,"url":null,"abstract":"<div><p>This study presents the design, fabrication, and optimization of an inlay-knitted heating textile intended for wearable heat therapy. A low-twisted cotton sheath encapsulating stainless-steel conductive yarn was engineered into a core-sheath configuration and integrated into a rib-knit fabric via inlay knitting. A Box–Behnken Design (BBD) was employed to systematically investigate the effects of applied voltage, number of conductive yarn plies, and heating zone spacing on the surface temperature. Experimental results revealed that increasing yarn plies significantly reduced electrical resistance, thereby enhancing thermal output. The developed regression model exhibited high accuracy (<i>R</i><sup>2</sup> = 0.9902), with ANOVA confirming the statistical significance of process parameters. Optimized fabrication conditions were identified to maintain a therapeutic surface temperature of 40 °C while minimizing power consumption, verified experimentally with strong agreement to model predictions. The resultant textile demonstrated uniform, stable heating and excellent flexibility, comfort, and safety, validating its suitability for localized musculoskeletal pain relief. This approach offers a scalable pathway for producing energy-efficient, comfortable, and safe knitted heating fabrics for wearable thermal therapy.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 28","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-15876-8","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This study presents the design, fabrication, and optimization of an inlay-knitted heating textile intended for wearable heat therapy. A low-twisted cotton sheath encapsulating stainless-steel conductive yarn was engineered into a core-sheath configuration and integrated into a rib-knit fabric via inlay knitting. A Box–Behnken Design (BBD) was employed to systematically investigate the effects of applied voltage, number of conductive yarn plies, and heating zone spacing on the surface temperature. Experimental results revealed that increasing yarn plies significantly reduced electrical resistance, thereby enhancing thermal output. The developed regression model exhibited high accuracy (R2 = 0.9902), with ANOVA confirming the statistical significance of process parameters. Optimized fabrication conditions were identified to maintain a therapeutic surface temperature of 40 °C while minimizing power consumption, verified experimentally with strong agreement to model predictions. The resultant textile demonstrated uniform, stable heating and excellent flexibility, comfort, and safety, validating its suitability for localized musculoskeletal pain relief. This approach offers a scalable pathway for producing energy-efficient, comfortable, and safe knitted heating fabrics for wearable thermal therapy.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.