Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications.

IF 3 3区 工程技术 Q2 CHEMISTRY, ANALYTICAL
Micromachines Pub Date : 2025-08-26 DOI:10.3390/mi16090980
Kai Werum, Wolfgang Eberhardt, Dieter Reenaers, Thomas Mager, Mika Endl, André Zimmermann, Wim Deferme
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Abstract

This paper aims to present an overview of the state-of-the-art materials and technologies that can be used to create electronic circuits on 3D plastic carriers also known as 3D electronics. Strategies for print-based and laser-based 3D electronics will be discussed as well as the techniques to apply the circuit carrier and the way interconnection technology can be used to combine electronic components on top of the circuit carrier. A basic explanation of the functional principles, materials, and applications is given for different substrate and interconnection technologies. The aim is to make it easier to compare different technologies and its required materials to make the right decisions on what technology is best suited for the job. For this purpose, comparison tables for 3D plastic circuit carrier technologies and substrate materials considering their temperature stability were created. It can be concluded that there are a lot of influencing factors that determine which technologies are best suited for application. The most important factors are the 3D complexity and the field of application, the required structure size of the circuit, and the required production quantity.

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3D塑料电路载体的组装和互连技术:技术,材料和应用概述。
本文旨在概述最先进的材料和技术,可用于在3D塑料载体上创建电子电路,也称为3D电子学。将讨论基于打印和基于激光的3D电子学的策略,以及应用电路载体的技术和互连技术可用于在电路载体上组合电子元件的方式。对不同的衬底和互连技术的功能原理、材料和应用进行了基本的解释。这样做的目的是为了更容易地比较不同的技术及其所需的材料,从而做出正确的决定,选择最适合这项工作的技术。为此,创建了考虑温度稳定性的3D塑料电路载体技术和衬底材料的比较表。可以得出结论,有很多影响因素决定了哪些技术最适合应用。最重要的因素是三维复杂性和应用领域,电路所需的结构尺寸,以及所需的生产数量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Micromachines
Micromachines NANOSCIENCE & NANOTECHNOLOGY-INSTRUMENTS & INSTRUMENTATION
CiteScore
5.20
自引率
14.70%
发文量
1862
审稿时长
16.31 days
期刊介绍: Micromachines (ISSN 2072-666X) is an international, peer-reviewed open access journal which provides an advanced forum for studies related to micro-scaled machines and micromachinery. It publishes reviews, regular research papers and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. There is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced.
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