Kai Werum, Wolfgang Eberhardt, Dieter Reenaers, Thomas Mager, Mika Endl, André Zimmermann, Wim Deferme
{"title":"Assembly and Interconnection Technologies for 3D Plastic Circuit Carriers: An Overview of Technologies, Materials, and Applications.","authors":"Kai Werum, Wolfgang Eberhardt, Dieter Reenaers, Thomas Mager, Mika Endl, André Zimmermann, Wim Deferme","doi":"10.3390/mi16090980","DOIUrl":null,"url":null,"abstract":"<p><p>This paper aims to present an overview of the state-of-the-art materials and technologies that can be used to create electronic circuits on 3D plastic carriers also known as 3D electronics. Strategies for print-based and laser-based 3D electronics will be discussed as well as the techniques to apply the circuit carrier and the way interconnection technology can be used to combine electronic components on top of the circuit carrier. A basic explanation of the functional principles, materials, and applications is given for different substrate and interconnection technologies. The aim is to make it easier to compare different technologies and its required materials to make the right decisions on what technology is best suited for the job. For this purpose, comparison tables for 3D plastic circuit carrier technologies and substrate materials considering their temperature stability were created. It can be concluded that there are a lot of influencing factors that determine which technologies are best suited for application. The most important factors are the 3D complexity and the field of application, the required structure size of the circuit, and the required production quantity.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"16 9","pages":""},"PeriodicalIF":3.0000,"publicationDate":"2025-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC12471658/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micromachines","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.3390/mi16090980","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, ANALYTICAL","Score":null,"Total":0}
引用次数: 0
Abstract
This paper aims to present an overview of the state-of-the-art materials and technologies that can be used to create electronic circuits on 3D plastic carriers also known as 3D electronics. Strategies for print-based and laser-based 3D electronics will be discussed as well as the techniques to apply the circuit carrier and the way interconnection technology can be used to combine electronic components on top of the circuit carrier. A basic explanation of the functional principles, materials, and applications is given for different substrate and interconnection technologies. The aim is to make it easier to compare different technologies and its required materials to make the right decisions on what technology is best suited for the job. For this purpose, comparison tables for 3D plastic circuit carrier technologies and substrate materials considering their temperature stability were created. It can be concluded that there are a lot of influencing factors that determine which technologies are best suited for application. The most important factors are the 3D complexity and the field of application, the required structure size of the circuit, and the required production quantity.
期刊介绍:
Micromachines (ISSN 2072-666X) is an international, peer-reviewed open access journal which provides an advanced forum for studies related to micro-scaled machines and micromachinery. It publishes reviews, regular research papers and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. There is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced.