{"title":"Effect of Water Film Induced by Wet Shot Peening on Dimple Size and Residual Stress Distribution.","authors":"Chao Fang, Zhongjin Wang","doi":"10.3390/ma18184347","DOIUrl":null,"url":null,"abstract":"<p><p>Recently, considerable research has been conducted on wet shot peening (WSP), but a detailed investigation of this process is still lacking. For a systematic study, four three-dimensional models of WSP and shot peening (SP) were developed using the finite element method (FEM), based on the coupled Eulerian-Lagrangian (CEL) method. Micron-scaled water film is directly observed during WSP processing. Simulation results indicate that the water film has a significant impact on the dimple size and residual stress distribution. Compared with SP, WSP can produce (a) a dimple with a larger curvature radius, (b) greater compressive residual stress in the surface layer with a larger area, and (c) more uniformly distributed surface residual stress. This work reveals the mechanism underlying the changes mentioned above, which provides rationales for the promotional applications of WSP.</p>","PeriodicalId":18281,"journal":{"name":"Materials","volume":"18 18","pages":""},"PeriodicalIF":3.2000,"publicationDate":"2025-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC12471698/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.3390/ma18184347","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Recently, considerable research has been conducted on wet shot peening (WSP), but a detailed investigation of this process is still lacking. For a systematic study, four three-dimensional models of WSP and shot peening (SP) were developed using the finite element method (FEM), based on the coupled Eulerian-Lagrangian (CEL) method. Micron-scaled water film is directly observed during WSP processing. Simulation results indicate that the water film has a significant impact on the dimple size and residual stress distribution. Compared with SP, WSP can produce (a) a dimple with a larger curvature radius, (b) greater compressive residual stress in the surface layer with a larger area, and (c) more uniformly distributed surface residual stress. This work reveals the mechanism underlying the changes mentioned above, which provides rationales for the promotional applications of WSP.
期刊介绍：
Materials (ISSN 1996-1944) is an open access journal of related scientific research and technology development. It publishes reviews, regular research papers (articles) and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. Materials provides a forum for publishing papers which advance the in-depth understanding of the relationship between the structure, the properties or the functions of all kinds of materials. Chemical syntheses, chemical structures and mechanical, chemical, electronic, magnetic and optical properties and various applications will be considered.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
