Key Physicochemical Properties and Service Characteristics of Low Dielectric Polyimide-based Nanocomposites

IF 4 2区 化学 Q2 POLYMER SCIENCE
Zhen-Yu Wang, Tong Zhao, Shuo Meng, Xiao-Long Wang, Ying Sun, Yuan-Tao Zhang
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Abstract

In high-frequency electrical energy systems, polyimide (PI) composite insulation materials need to possess a low dielectric constant, sufficient thermal conductivity, and robust interfacial adhesion to ensure reliable performance under elevated temperatures and pressures. These aspects are crucial for preventing local overheating and electrical breakdown, thereby ensuring reliable equipment operation. Traditional PI insulation materials often exhibit high dielectric constants and pronounced dielectric losses, compromising their insulation efficiency. In this study, molecular dynamics simulations were employed to incorporate polyhedral oligomeric silsesquioxanes (POSS) into PI through physical blending and chemical bonding to enhance dielectric properties. Key parameters of the PI/POSS composite system, including dielectric constant, thermal conductivity, glass transition temperature, Young’s modulus, Poisson’s ratio, and interfacial adhesion energy, were systematically evaluated for both doping methods. The degradation behavior of the PI composites under high-temperature and electric field conditions was also simulated to elucidate degradation pathways and product distributions, providing insights for designing low-dielectric insulation materials. Doping with POSS significantly reduces the dielectric constant of PI, thereby improving insulation performance, thermal stability, mechanical strength, and interfacial adhesion. At an optimal POSS doping ratio, the thermal conductivity of PI is enhanced. Compared with the physical blending system, the chemical bonding system yields more substantial improvements across all evaluated properties. Under high-temperature and strong electric field conditions, POSS doping enhances interfacial adhesion and thermal stability, effectively suppressing the cleavage of key chemical bonds, reducing CO emissions, and increasing the formation of oxygen-containing intermediates and water molecules, which contributes to improved environmental sustainability.

低介电聚酰亚胺基纳米复合材料的关键物理化学性能和使用特性
在高频电能系统中,聚酰亚胺(PI)复合绝缘材料需要具有低介电常数、足够的导热性和强大的界面附着力,以确保在高温高压下的可靠性能。这些方面对于防止局部过热和电气故障至关重要,从而确保设备可靠运行。传统的PI绝缘材料通常具有较高的介电常数和明显的介电损耗,从而影响其绝缘效率。在本研究中,利用分子动力学模拟,通过物理共混和化学键将多面体低聚硅氧烷(POSS)掺入PI中以提高介电性能。系统地评价了两种掺杂方法的PI/POSS复合体系的关键参数,包括介电常数、导热系数、玻璃化转变温度、杨氏模量、泊松比和界面粘附能。模拟了PI复合材料在高温和电场条件下的降解行为,阐明了降解途径和产物分布,为设计低介电绝缘材料提供了参考。POSS的掺杂显著降低了PI的介电常数,从而提高了绝缘性能、热稳定性、机械强度和界面附着力。在最佳的POSS掺杂比下,PI的导热性得到增强。与物理共混体系相比,化学键合体系在所有评估性能方面都有更大的改善。在高温和强电场条件下,POSS掺杂增强了界面附着力和热稳定性,有效抑制了关键化学键的裂解,减少了CO排放,增加了含氧中间体和水分子的形成,有助于提高环境可持续性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Chinese Journal of Polymer Science
Chinese Journal of Polymer Science 化学-高分子科学
CiteScore
7.10
自引率
11.60%
发文量
218
审稿时长
6.0 months
期刊介绍: Chinese Journal of Polymer Science (CJPS) is a monthly journal published in English and sponsored by the Chinese Chemical Society and the Institute of Chemistry, Chinese Academy of Sciences. CJPS is edited by a distinguished Editorial Board headed by Professor Qi-Feng Zhou and supported by an International Advisory Board in which many famous active polymer scientists all over the world are included. The journal was first published in 1983 under the title Polymer Communications and has the current name since 1985. CJPS is a peer-reviewed journal dedicated to the timely publication of original research ideas and results in the field of polymer science. The issues may carry regular papers, rapid communications and notes as well as feature articles. As a leading polymer journal in China published in English, CJPS reflects the new achievements obtained in various laboratories of China, CJPS also includes papers submitted by scientists of different countries and regions outside of China, reflecting the international nature of the journal.
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