Enhanced Near-Room-Temperature Thermoelectric Performance of Mg3Bi2 Through Ag Doping

IF 3.9 2区 材料科学 Q2 METALLURGY & METALLURGICAL ENGINEERING
Dan Guo, Yijun Ran, Juan He, Lili Zhang, Dayi Zhou, Zhi Yu, Kaiping Tai
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Abstract

Mg3Bi2-based films are promising near-room-temperature thermoelectric materials for the development of flexible thermoelectric devices. However, the high hole concentration caused by the abundance of intrinsic Mg vacancies easily leads to deterioration of electrical properties, especially for p-type Mg3Bi2 film. And the optimization of thermal conductivity of the Mg3Bi2-based films is barely investigated. In this work, we demonstrate the improved thermoelectric performances of p-type Mg3Bi2 through Ag doping by magnetron sputtering. This doping successfully reduces the hole concentration and broadens the band gap of Mg3Bi2, thus resulting in a peak power factor of 442 μW m−1 K−2 at 525 K. At the same time, Ag doping-induced fluctuations in mass and microscopic strain effectively enhanced the phonon scattering to reduce the lattice thermal conductivity. Consequently, a maximum thermoelectric figure of merit of 0.22 is achieved at 525 K. Its near-room-temperature thermoelectric performances demonstrate superior performance compared to many Mg3Bi2-based films. To further evaluate its potential for thermoelectric power generation, we fabricated a thermoelectric device using Ag-doped Mg3Bi2 films, which achieved a power density of 864 μW cm⁻2 at 35 K temperature difference. This study presents an effective strategy for the advancement of Mg3Bi2-based films for application in micro-thermoelectric devices.

Ag掺杂增强Mg3Bi2近室温热电性能
mg3bi2基薄膜是一种很有前途的近室温热电材料,可用于柔性热电器件的开发。然而,大量的本然Mg空位导致的高空穴浓度容易导致电学性能的恶化,特别是对于p型Mg3Bi2薄膜。而对mg3bi2基薄膜导热性能的优化研究较少。在这项工作中,我们证明了通过磁控溅射掺杂Ag改善p型Mg3Bi2的热电性能。该掺杂成功地降低了Mg3Bi2的空穴浓度并拓宽了带隙,从而在525 K时获得了442 μW m−1 K−2的峰值功率因数。同时,银掺杂引起的质量和微观应变波动有效地增强了声子散射,降低了晶格的导热系数。因此,在525 K时达到了0.22的最大热电值。与许多mg3bi2基薄膜相比,其近室温热电性能表现出优越的性能。为了进一步评估其在热电发电方面的潜力,我们利用掺银Mg3Bi2薄膜制作了热电器件,在35 K温差下实现了864 μW cm⁻2的功率密度。本研究为推进mg3bi2基薄膜在微热电器件中的应用提供了一种有效的策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Acta Metallurgica Sinica-English Letters
Acta Metallurgica Sinica-English Letters METALLURGY & METALLURGICAL ENGINEERING-
CiteScore
6.60
自引率
14.30%
发文量
122
审稿时长
2 months
期刊介绍: This international journal presents compact reports of significant, original and timely research reflecting progress in metallurgy, materials science and engineering, including materials physics, physical metallurgy, and process metallurgy.
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