High-temperature electronic packaging for power modules: advances in sintering and transient liquid phase bonding technologies

Abstract

The increasing demand for enhanced thermal stability and power density in electric vehicle (EV) power modules presents challenges for conventional packaging technologies, including inadequate thermal conductivity, limited high-temperature reliability, and suboptimal environmental compatibility. This review systematically summarizes recent advances in two pivotal high-temperature electronic packaging technologies: sintering and transient liquid phase (TLP) bonding. It examines microstructural regulation mechanisms in silver (Ag), copper (Cu), and nickel (Ni)-based sintering materials for power module applications. The analysis covers the effects of particle size, morphology, and solvent selection on sintering density, electrical and thermal conductivity, and mechanical strength. A comparative assessment of advanced processes such as pressure sintering, pressureless sintering, and laser-assisted sintering is presented, focusing on their mechanisms for reducing porosity, mitigating oxidation, and enhancing interface bonding strength. Additionally, TLP bonding characteristics are explored, emphasizing its advantages in low-temperature connections and high-temperature performance via high-melting point intermetallic compounds. The findings show that sintering technology provides a robust solution for high-temperature packaging with superior thermal conductivity and mechanical strength, while TLP enhances high-temperature stability. Future research should optimize multimodal particle design, develop cost-effective, sustainable materials, and integrate processes like ultrasound and induction heating to expand these technologies' application in wide-bandgap semiconductor devices.