Spall strength measurements of epoxy resin with varying polyphenylene sulfone content cured at \(160\,^{\circ }\hbox {C}\) and \(200\,^{\circ }\hbox {C}\) temperature
V. Mochalova, A. Utkin, A. Savinykh, G. Garkushin, D. Nikolaev, A. Savchenko, A. Kapasharov, G. Malkov
{"title":"Spall strength measurements of epoxy resin with varying polyphenylene sulfone content cured at \\(160\\,^{\\circ }\\hbox {C}\\) and \\(200\\,^{\\circ }\\hbox {C}\\) temperature","authors":"V. Mochalova, A. Utkin, A. Savinykh, G. Garkushin, D. Nikolaev, A. Savchenko, A. Kapasharov, G. Malkov","doi":"10.1007/s00193-025-01224-6","DOIUrl":null,"url":null,"abstract":"<div><p>The addition of materials such as polysulfone as a modifier to epoxy binders has the potential to significantly improve the crack resistance of the material. In this work, the effect of the polyphenylene sulfone additive on the epoxy resin strength has been studied experimentally. Epoxy samples were cured at 160 and <span>\\(200\\,^{\\circ }\\hbox {C}\\)</span> temperature. Under static conditions, the addition of 5% polyphenylene sulfone to epoxy cured at <span>\\(200\\,^{\\circ }\\hbox {C}\\)</span> leads to strength increase. Under dynamic loading, the spall strength decreased with increased polyphenylene sulfone addition in all epoxy resin samples. When the incoming pulse pressure is low, the spall strength of the samples cured at both temperatures is similar. The curing temperature effect begins to manifest itself at higher incoming pulse pressures in samples with 3–5% of polyphenylene sulfone. Curing temperature affects the characteristics of the spall fracture kinetics as well.</p></div>","PeriodicalId":775,"journal":{"name":"Shock Waves","volume":"35 4","pages":"349 - 360"},"PeriodicalIF":1.8000,"publicationDate":"2025-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Shock Waves","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s00193-025-01224-6","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MECHANICS","Score":null,"Total":0}
引用次数: 0
Abstract
The addition of materials such as polysulfone as a modifier to epoxy binders has the potential to significantly improve the crack resistance of the material. In this work, the effect of the polyphenylene sulfone additive on the epoxy resin strength has been studied experimentally. Epoxy samples were cured at 160 and \(200\,^{\circ }\hbox {C}\) temperature. Under static conditions, the addition of 5% polyphenylene sulfone to epoxy cured at \(200\,^{\circ }\hbox {C}\) leads to strength increase. Under dynamic loading, the spall strength decreased with increased polyphenylene sulfone addition in all epoxy resin samples. When the incoming pulse pressure is low, the spall strength of the samples cured at both temperatures is similar. The curing temperature effect begins to manifest itself at higher incoming pulse pressures in samples with 3–5% of polyphenylene sulfone. Curing temperature affects the characteristics of the spall fracture kinetics as well.
在环氧粘合剂中加入聚砜等材料作为改性剂,有可能显著提高材料的抗裂性。本文通过实验研究了聚苯砜添加剂对环氧树脂强度的影响。环氧树脂样品在160和\(200\,^{\circ }\hbox {C}\)温度下固化。在静态条件下,加5% polyphenylene sulfone to epoxy cured at \(200\,^{\circ }\hbox {C}\) leads to strength increase. Under dynamic loading, the spall strength decreased with increased polyphenylene sulfone addition in all epoxy resin samples. When the incoming pulse pressure is low, the spall strength of the samples cured at both temperatures is similar. The curing temperature effect begins to manifest itself at higher incoming pulse pressures in samples with 3–5% of polyphenylene sulfone. Curing temperature affects the characteristics of the spall fracture kinetics as well.
期刊介绍:
Shock Waves provides a forum for presenting and discussing new results in all fields where shock and detonation phenomena play a role. The journal addresses physicists, engineers and applied mathematicians working on theoretical, experimental or numerical issues, including diagnostics and flow visualization.
The research fields considered include, but are not limited to, aero- and gas dynamics, acoustics, physical chemistry, condensed matter and plasmas, with applications encompassing materials sciences, space sciences, geosciences, life sciences and medicine.
Of particular interest are contributions which provide insights into fundamental aspects of the techniques that are relevant to more than one specific research community.
The journal publishes scholarly research papers, invited review articles and short notes, as well as comments on papers already published in this journal. Occasionally concise meeting reports of interest to the Shock Waves community are published.