{"title":"Quantification of the Impact of Hexagonal Percentage on the Elastic and Acoustic Properties of SiC polytypes (3C, 10H, 8H, 6H and 4H)","authors":"Souheyr Guernoub, Ibtissem Touati, Assia Khoualdia, Houssem-eddine Doghmane, Abdellaziz Doghmane","doi":"10.1007/s12633-025-03326-3","DOIUrl":null,"url":null,"abstract":"<div><p>Silicon carbide, SiC, polytypes exhibit properties that can vary and can be influenced by factors such as hexagonality percentage, h. The objective of this work is to determine the impact of hexagonality percentage on several elastic and acoustic properties of SiC polytypes (3C, 10H, 8H, 6H, and 4H-SiC). We have successfully formulated relations linking the elastic moduli to the energy gaps (Eg) of the SiC polytypes after an in-depth study of the elastic moduli (Young's modulus E, bulk modulus B, and shear modulus G) in relation to the energy gap Eg. Then, the influence of hexagonality percentage on the elastic properties of SiC polytypes and their acoustic velocities (longitudinal, transverse, and Rayleigh) as well as their critical angles <span>\\(\\left({\\uptheta }_{\\text{L}}, {\\uptheta }_{\\text{T}}\\text{ et }{\\uptheta }_{\\text{R}}\\right)\\)</span> was analyzed and discussed to obtain semi-empirical formulas in the form: <span>\\(F\\left(h\\right)=\\pm \\alpha h+\\beta\\)</span>, which implies the existence of a near-linear relation between the elastic and acostic properties of the SiC polytypes with hexagonality percentage h. We have obtained results that theoretically support the development of SiC polytypes.</p></div>","PeriodicalId":776,"journal":{"name":"Silicon","volume":"17 9","pages":"2015 - 2026"},"PeriodicalIF":3.3000,"publicationDate":"2025-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Silicon","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12633-025-03326-3","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Silicon carbide, SiC, polytypes exhibit properties that can vary and can be influenced by factors such as hexagonality percentage, h. The objective of this work is to determine the impact of hexagonality percentage on several elastic and acoustic properties of SiC polytypes (3C, 10H, 8H, 6H, and 4H-SiC). We have successfully formulated relations linking the elastic moduli to the energy gaps (Eg) of the SiC polytypes after an in-depth study of the elastic moduli (Young's modulus E, bulk modulus B, and shear modulus G) in relation to the energy gap Eg. Then, the influence of hexagonality percentage on the elastic properties of SiC polytypes and their acoustic velocities (longitudinal, transverse, and Rayleigh) as well as their critical angles \(\left({\uptheta }_{\text{L}}, {\uptheta }_{\text{T}}\text{ et }{\uptheta }_{\text{R}}\right)\) was analyzed and discussed to obtain semi-empirical formulas in the form: \(F\left(h\right)=\pm \alpha h+\beta\), which implies the existence of a near-linear relation between the elastic and acostic properties of the SiC polytypes with hexagonality percentage h. We have obtained results that theoretically support the development of SiC polytypes.
期刊介绍:
The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.