Synthesis and Properties of Heat-resistant Polyimides Films Containing Crosslinkable Group-tetrafluorostyrene

IF 4 2区 化学 Q2 POLYMER SCIENCE
Tian-Yong Zhang, Jia-Ning Yu, Sui-Sui Wang, Ya-Mei Chai, Shuang Jiang, Hong-Li An, Ruo-Xi Sun, Bin Li
{"title":"Synthesis and Properties of Heat-resistant Polyimides Films Containing Crosslinkable Group-tetrafluorostyrene","authors":"Tian-Yong Zhang,&nbsp;Jia-Ning Yu,&nbsp;Sui-Sui Wang,&nbsp;Ya-Mei Chai,&nbsp;Shuang Jiang,&nbsp;Hong-Li An,&nbsp;Ruo-Xi Sun,&nbsp;Bin Li","doi":"10.1007/s10118-025-3292-z","DOIUrl":null,"url":null,"abstract":"<div><p>Polyimide (PI) is widely used in high-tech fields such as microelectronics, aerospace, and national defense because of its excellent optical properties, high- and low-temperature resistance, and good dimensional stability. To achieve the desired properties of PI, the monomers 2,6-diaminopyrimidin-4-ol (DAPD) and 6-(2,3,5,6-tetrafluoro-4-vinylphenoxy) pyrimidin-2,4-diamine (DAFPD), which contains crosslinkable functional groups, were designed and synthesized successfully and copolymerized with 4,4′-oxydianiline (ODA) and 4,4-hexafluoroisopropylphthalic anhydride (6FDA). The prepared PI film (PI-3), with rigid backbones and loose packing had excellent heat resistance (<i>T</i><sub>d5%</sub>=489 °C) and optical properties (<i>T</i><sub>450</sub>=82%). Furthermore, a crosslinked PI film (c-PI-3) with more heat-resistant (<i>T</i><sub>d5%</sub>=524 °C) and better mechanical properties (σ=125.46 MPa), can be obtained through thermal crosslinking of tetrafluorostyrene. In addition, the changes in the properties caused by the proportion of DAFPD added during copolymerization are discussed comprehensively. This study provides a promising candidate for heat-resistant PI materials.</p></div>","PeriodicalId":517,"journal":{"name":"Chinese Journal of Polymer Science","volume":"43 5","pages":"863 - 874"},"PeriodicalIF":4.0000,"publicationDate":"2025-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Chinese Journal of Polymer Science","FirstCategoryId":"92","ListUrlMain":"https://link.springer.com/article/10.1007/s10118-025-3292-z","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0

Abstract

Polyimide (PI) is widely used in high-tech fields such as microelectronics, aerospace, and national defense because of its excellent optical properties, high- and low-temperature resistance, and good dimensional stability. To achieve the desired properties of PI, the monomers 2,6-diaminopyrimidin-4-ol (DAPD) and 6-(2,3,5,6-tetrafluoro-4-vinylphenoxy) pyrimidin-2,4-diamine (DAFPD), which contains crosslinkable functional groups, were designed and synthesized successfully and copolymerized with 4,4′-oxydianiline (ODA) and 4,4-hexafluoroisopropylphthalic anhydride (6FDA). The prepared PI film (PI-3), with rigid backbones and loose packing had excellent heat resistance (Td5%=489 °C) and optical properties (T450=82%). Furthermore, a crosslinked PI film (c-PI-3) with more heat-resistant (Td5%=524 °C) and better mechanical properties (σ=125.46 MPa), can be obtained through thermal crosslinking of tetrafluorostyrene. In addition, the changes in the properties caused by the proportion of DAFPD added during copolymerization are discussed comprehensively. This study provides a promising candidate for heat-resistant PI materials.

含交联基-四氟苯乙烯耐热聚酰亚胺薄膜的合成及性能研究
聚酰亚胺(PI)以其优异的光学性能、耐高低温性能和良好的尺寸稳定性,广泛应用于微电子、航空航天、国防等高科技领域。为了获得理想的PI性能,设计并成功合成了含有交联官能团的单体2,6-二氨基嘧啶-4-醇(DAPD)和6-(2,3,5,6-四氟-4-乙烯基苯氧基)嘧啶-2,4-二胺(DAFPD),并与4,4 ' -氧二胺(ODA)和4,4-六氟异丙基邻苯酐(6FDA)共聚。所制备的PI-3薄膜具有刚性骨架和松散填料,具有优异的耐热性(Td5%=489℃)和光学性能(T450=82%)。通过对四氟苯乙烯进行热交联,可以得到耐热性更高(Td5%=524℃)、力学性能更好(σ=125.46 MPa)的交联PI膜(C -PI-3)。此外,还全面讨论了共聚过程中DAFPD添加比例对性能的影响。该研究为耐热PI材料提供了一个有前途的候选材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Chinese Journal of Polymer Science
Chinese Journal of Polymer Science 化学-高分子科学
CiteScore
7.10
自引率
11.60%
发文量
218
审稿时长
6.0 months
期刊介绍: Chinese Journal of Polymer Science (CJPS) is a monthly journal published in English and sponsored by the Chinese Chemical Society and the Institute of Chemistry, Chinese Academy of Sciences. CJPS is edited by a distinguished Editorial Board headed by Professor Qi-Feng Zhou and supported by an International Advisory Board in which many famous active polymer scientists all over the world are included. The journal was first published in 1983 under the title Polymer Communications and has the current name since 1985. CJPS is a peer-reviewed journal dedicated to the timely publication of original research ideas and results in the field of polymer science. The issues may carry regular papers, rapid communications and notes as well as feature articles. As a leading polymer journal in China published in English, CJPS reflects the new achievements obtained in various laboratories of China, CJPS also includes papers submitted by scientists of different countries and regions outside of China, reflecting the international nature of the journal.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信