{"title":"Automated fabrication of U-shaped silica optical fibers with high reproducibility and sensitivity","authors":"Kiyoshi Hirakawa , Minoru Okamoto , Akihito Kurosawa , Keita Mitsune , Yusaku Yanagibashi , Hirofumi Okuda , Seung-Woo Lee","doi":"10.1016/j.sna.2025.117077","DOIUrl":null,"url":null,"abstract":"<div><div>An automated bending process was developed for preparing U-shaped optical fibers to minimize variability and enhance the refractive index (RI) response for sensing applications. A silica optical fiber with a core diameter of 600 µm and target bending radius of 1.25 mm was formed into a U-shape by three consecutive bending processes to enhance its stability. A jeweler’s flame burner was employed for localized heating using air instead of oxygen as the oxidizing gas to avoid an excessive temperature rise. The movement of the flame was precisely controlled by a compact linear actuator with a pulse input for micrometer-level adjustments. A CO<sub>2</sub> laser was used to create a smooth end face for the optical fiber and result in a polished finish. Compared with manually fabricated U-shaped probes, the automated process combined with CO₂ laser cutting reduced the coefficient of variation (CV) of optical power from 11.1 % to 3.23 %, representing a 3.4-fold improvement in reproducibility. The RI response at a wavelength of 660 nm was measured to be 115.8 dB per refractive index unit (RIU) within a broad RI range of 1.330–1.430.</div></div>","PeriodicalId":21689,"journal":{"name":"Sensors and Actuators A-physical","volume":"395 ","pages":"Article 117077"},"PeriodicalIF":4.9000,"publicationDate":"2025-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensors and Actuators A-physical","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0924424725008830","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
An automated bending process was developed for preparing U-shaped optical fibers to minimize variability and enhance the refractive index (RI) response for sensing applications. A silica optical fiber with a core diameter of 600 µm and target bending radius of 1.25 mm was formed into a U-shape by three consecutive bending processes to enhance its stability. A jeweler’s flame burner was employed for localized heating using air instead of oxygen as the oxidizing gas to avoid an excessive temperature rise. The movement of the flame was precisely controlled by a compact linear actuator with a pulse input for micrometer-level adjustments. A CO2 laser was used to create a smooth end face for the optical fiber and result in a polished finish. Compared with manually fabricated U-shaped probes, the automated process combined with CO₂ laser cutting reduced the coefficient of variation (CV) of optical power from 11.1 % to 3.23 %, representing a 3.4-fold improvement in reproducibility. The RI response at a wavelength of 660 nm was measured to be 115.8 dB per refractive index unit (RIU) within a broad RI range of 1.330–1.430.
期刊介绍:
Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:
• Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.
• Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.
• Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.
• Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.
Etc...