Slip mode analysis in BCC tantalum with HRDIC

IF 7 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Science and Engineering: A Pub Date : 2025-09-24 DOI:10.1016/j.msea.2025.149179

Guowei Zhou , David T. Fullwood , Robert H. Wagoner , Stephen R. Niezgoda , Tristan Russell , David Lunt

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引用次数: 0

Abstract

Slip in BCC metals is reported to include pencil glide on maximum shear stress planes (MSSPs) as well as slip on various standard crystallographic slip systems. High-resolution digital image correlation (HRDIC) often enables unambiguous grain-scale slip analysis and was used to characterize the slip modes in large-grained BCC tantalum tensile specimens in the current work. Slip of {110}, {112} and MSSP types was observed based on the slip trace analysis. The critical resolved shear stress (CRSS) for {112} slip is approximately 9.5 % higher than {110} slip while the CRSS for pencil glide is approximately 7.3 % higher than for {110} slip. Activation of unexpected slip systems near grain boundaries was found to be dependent on the local stress states. HRDIC reveals the size of the grain boundary zone (GBZ), with strain decreasing toward the grain centers, and the width of the GBZ is determined to be approximately 140 μm in the region of GBs that exhibited clear strain gradients, for grains of average diameter 10 mm, and with little slip transmission across the GB observed.

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用HRDIC分析BCC钽的滑移模式

据报道，BCC金属的滑移包括在最大剪切应力面（mssp）上的铅笔滑动以及在各种标准晶体滑移系统上的滑移。高分辨率数字图像相关（HRDIC）通常可以实现明确的晶粒级滑移分析，并在目前的工作中用于表征大晶粒BCC钽拉伸试样的滑移模式。根据滑移迹分析，观测到{110}、{112}和MSSP类型的滑移。{112}滑移的临界分解剪应力（CRSS）比{110}滑移高9.5%，而铅笔滑动的临界分解剪应力（CRSS）比{110}滑移高7.3%。发现晶界附近意外滑移系统的激活依赖于局部应力状态。HRDIC揭示了晶界区（GBZ）的大小，应变向晶心方向减小，在平均直径为10 mm的晶界区应变梯度明显的区域，GBZ的宽度约为140 μm，滑移传递很小。

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来源期刊

Materials Science and Engineering: A 工程技术-材料科学：综合

CiteScore

11.50

自引率

15.60%

发文量

1811

审稿时长

31 days

期刊介绍： Materials Science and Engineering A provides an international medium for the publication of theoretical and experimental studies related to the load-bearing capacity of materials as influenced by their basic properties, processing history, microstructure and operating environment. Appropriate submissions to Materials Science and Engineering A should include scientific and/or engineering factors which affect the microstructure - strength relationships of materials and report the changes to mechanical behavior.