{"title":"Transition of evaporation mechanisms in nanoscale liquid films: Effects of curvature and film thickness from molecular dynamics","authors":"Mingjun Liao, Qianyi Liu, Wenpeng Hong, Fangfang Xie","doi":"10.1016/j.ijheatmasstransfer.2025.127867","DOIUrl":null,"url":null,"abstract":"<div><div>This study presents the first molecular dynamics investigation that systematically reveals the evaporation behavior of nanoscale liquid films on both planar and curved metallic substrates, addressing a critical gap in the understanding of phase change phenomena at non-planar interfaces. By constructing geometrically consistent systems with either flat or spherical gold substrates, and examining argon liquid films of varying thicknesses (2–9 nm), we comprehensively analyze the effects of surface curvature on interfacial heat transfer, evaporation front dynamics, and energy conversion efficiency. Simulation results demonstrate that the curved surface significantly enhances evaporation efficiency by reducing interfacial thermal resistance and intensifying molecular excitation, particularly under thinner film conditions. A semi-quantitative theoretical model is further proposed, establishing an inverse dependence of evaporation efficiency on both film thickness and substrate curvature radius, effectively capturing the efficiency trends observed in the simulations. This work not only deepens the fundamental understanding of evaporation dynamics on curved interfaces but also provides a new theoretical and methodological basis for thermal management design in micro/nanoscale systems, offering substantial scientific and engineering value.</div></div>","PeriodicalId":336,"journal":{"name":"International Journal of Heat and Mass Transfer","volume":"255 ","pages":"Article 127867"},"PeriodicalIF":5.8000,"publicationDate":"2025-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Heat and Mass Transfer","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0017931025012025","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
This study presents the first molecular dynamics investigation that systematically reveals the evaporation behavior of nanoscale liquid films on both planar and curved metallic substrates, addressing a critical gap in the understanding of phase change phenomena at non-planar interfaces. By constructing geometrically consistent systems with either flat or spherical gold substrates, and examining argon liquid films of varying thicknesses (2–9 nm), we comprehensively analyze the effects of surface curvature on interfacial heat transfer, evaporation front dynamics, and energy conversion efficiency. Simulation results demonstrate that the curved surface significantly enhances evaporation efficiency by reducing interfacial thermal resistance and intensifying molecular excitation, particularly under thinner film conditions. A semi-quantitative theoretical model is further proposed, establishing an inverse dependence of evaporation efficiency on both film thickness and substrate curvature radius, effectively capturing the efficiency trends observed in the simulations. This work not only deepens the fundamental understanding of evaporation dynamics on curved interfaces but also provides a new theoretical and methodological basis for thermal management design in micro/nanoscale systems, offering substantial scientific and engineering value.
期刊介绍:
International Journal of Heat and Mass Transfer is the vehicle for the exchange of basic ideas in heat and mass transfer between research workers and engineers throughout the world. It focuses on both analytical and experimental research, with an emphasis on contributions which increase the basic understanding of transfer processes and their application to engineering problems.
Topics include:
-New methods of measuring and/or correlating transport-property data
-Energy engineering
-Environmental applications of heat and/or mass transfer