Elucidating electromigration-induced void failures in Ni/SnAg/Ni solder microbumps using 3D X-ray laminographic inspections

IF 5.5 2区材料科学 Q1 MATERIALS SCIENCE, CHARACTERIZATION & TESTING

Materials Characterization Pub Date : 2025-09-24 DOI:10.1016/j.matchar.2025.115589

Shih-Chi Yang , Chi-Hau Wu , Kai-Cheng Shie , King-Ning Tu , Chih Chen

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引用次数: 0

Abstract

This study manifests that high-resolution (0.4 μm) 3D X-ray microscopy can be leveraged for characterizing electromigration-induced (EM-induced) voids in Ni/ SnAg/Ni microbumps non-destructively and effectively. The results of 3D X-ray observations were comparable to those obtained by common destructive approaches. Inspected by consecutive laminographic observations, the voids were likely to shape irregularly and locate randomly. To evaluate the degrees of voiding failures, three levels including slight, medium, and severe were defined based on 3D X-ray observations. Voided microbumps were constantly detected (71 % ∼ 75 %) under high current density as 8× 10⁴ A/cm², whereas they were seldomly observed (33 %) at low current density as 1.6 × 10⁴ A/cm². Moreover, the dependencies of voiding failures on Sn α angles were explicated. The non-voided microbumps had intact Sn in high α angles, while the voided microbumps had residual Sn grains with lower α angles and could vary with different voiding levels.

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利用三维x射线层析检查阐明Ni/SnAg/Ni焊料微凸起中电迁移引起的空洞失效

该研究表明，高分辨率（0.4 μm） 3D x射线显微镜可以无损有效地表征Ni/ SnAg/Ni微凸起中电迁移诱导（em诱导）的空洞。三维x射线观察的结果与普通破坏方法获得的结果相当。通过连续的层析观察，孔洞可能形状不规则，位置随机。为了评估排尿失败的程度，根据三维x线观察定义了轻度、中度和重度三个级别。在8× 104 A/cm2的高电流密度下，经常检测到空心微凸起（71% ~ 75%），而在1.6 × 104 A/cm2的低电流密度下，很少观察到空心微凸起（33%）。此外，还分析了失效对Sn α角的依赖关系。未空化的微凸起在高α角处有完整的Sn，而空化的微凸起在低α角处有残余Sn晶粒，且随空化程度的不同而变化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Characterization 工程技术-材料科学：表征与测试

CiteScore

7.60

自引率

8.50%

发文量

746

审稿时长

36 days

期刊介绍： Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials. The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal. The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include: Metals & Alloys Ceramics Nanomaterials Biomedical materials Optical materials Composites Natural Materials.