Pan Tian , Weiyouran Hong , Yisen Huang , Wanjing Liu , Shengdu Yang , Xin Sun , Junhua Zhang
{"title":"Unlocking intrinsic thermal conductivity in BioBased liquid crystal epoxy and enabling alkali-developable photocurable dielectric coatings from epoxidized daidzein","authors":"Pan Tian , Weiyouran Hong , Yisen Huang , Wanjing Liu , Shengdu Yang , Xin Sun , Junhua Zhang","doi":"10.1016/j.polymer.2025.129143","DOIUrl":null,"url":null,"abstract":"<div><div>The development of biobased renewable resources is expected to alleviate the threat to the ecological environment and the obstacles to sustainable development caused by relying on fossil fuels. Here, based on biobased daidzein (DD) with rigid benzene rings and two hydroxyl groups was firstly prepared into epoxy compound (DDDE) by reacting with epichlorohydrin. Daidzein is a liquid crystal mesogen, by curing with 1,5-naphthalene diamine (NDA) in the liquid crystal state, the locally ordered structure can be preserved, thereby exhibiting intrinsic thermal conductivity characteristics. The curing system DDDE/NDA<sub>105</sub> (105 means cured at 105 °C) under liquid crystal phase obtained better thermal conductivity (λ = 0.34 W/(m·K)), storage modulus (G’ = 2548 MPa), and glass transition temperature (T<sub>g</sub> = 230 °C) than E51/NDA. On the other hand, photocurable alkali developer resin (DDAT) was synthesized by DDDE with acrylic acid (AA) and tetrahydro phthalic anhydride (THPA), and subsequently, a series of DDAT/DDDE/filler composite inks were prepared. Finally, the C8:2 ink stands out on PCB with the comprehensive performance of tensile strength (53.67 ± 1.41 MPa), elongation of fracture (4.11 ± 0.23 %), G’ (3761 MPa), T<sub>g</sub> (227 °C), and dielectric constant (3.54 at 100 Hz). The present work broadens the application of bio-based daidzein in high-performance inherently thermally conductive epoxy resins and alkaline developing photocuring inks.</div></div>","PeriodicalId":405,"journal":{"name":"Polymer","volume":"339 ","pages":"Article 129143"},"PeriodicalIF":4.5000,"publicationDate":"2025-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0032386125011292","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0
Abstract
The development of biobased renewable resources is expected to alleviate the threat to the ecological environment and the obstacles to sustainable development caused by relying on fossil fuels. Here, based on biobased daidzein (DD) with rigid benzene rings and two hydroxyl groups was firstly prepared into epoxy compound (DDDE) by reacting with epichlorohydrin. Daidzein is a liquid crystal mesogen, by curing with 1,5-naphthalene diamine (NDA) in the liquid crystal state, the locally ordered structure can be preserved, thereby exhibiting intrinsic thermal conductivity characteristics. The curing system DDDE/NDA105 (105 means cured at 105 °C) under liquid crystal phase obtained better thermal conductivity (λ = 0.34 W/(m·K)), storage modulus (G’ = 2548 MPa), and glass transition temperature (Tg = 230 °C) than E51/NDA. On the other hand, photocurable alkali developer resin (DDAT) was synthesized by DDDE with acrylic acid (AA) and tetrahydro phthalic anhydride (THPA), and subsequently, a series of DDAT/DDDE/filler composite inks were prepared. Finally, the C8:2 ink stands out on PCB with the comprehensive performance of tensile strength (53.67 ± 1.41 MPa), elongation of fracture (4.11 ± 0.23 %), G’ (3761 MPa), Tg (227 °C), and dielectric constant (3.54 at 100 Hz). The present work broadens the application of bio-based daidzein in high-performance inherently thermally conductive epoxy resins and alkaline developing photocuring inks.
期刊介绍:
Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics.
The main scope is covered but not limited to the following core areas:
Polymer Materials
Nanocomposites and hybrid nanomaterials
Polymer blends, films, fibres, networks and porous materials
Physical Characterization
Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films
Polymer Engineering
Advanced multiscale processing methods
Polymer Synthesis, Modification and Self-assembly
Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization
Technological Applications
Polymers for energy generation and storage
Polymer membranes for separation technology
Polymers for opto- and microelectronics.