Fractional-order Photo-thermoelastic Model for Laser-induced Dynamic Response in Sandwich Laminated Semiconductor Composites

IF 3.3 3区材料科学 Q3 CHEMISTRY, PHYSICAL

Silicon Pub Date : 2025-06-27 DOI:10.1007/s12633-025-03365-w

Chenlin Li, Jiaxi Zhou, Tianhu He

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引用次数: 0

Abstract

Laser heating technology as new hyperfine-precision approach which has been widely applied in the micro-machining of the sandwich laminated semiconductor composites (SLSC), where the memory-dependency of the strain and heat transport significantly increases. To accurately predict the micro-scale transient impact response of SLSC subjected to the non-Gaussian laser beam, a new Cattaneo-photo-thermoelastic model is established in this work based on memory-dependent strain and heat transport evolution laws with Atangana-Baleanu and Tempered-Caputo fractional derivatives. This model aims to analyze the influences of memory dependent thermal transport and strain as well as the parameters ratios of inner/outer layer materials on the photo-thermoelastic response and wave propagations in SLSC. The time-domain solutions of the one-dimensional multi-variables partial differential equations are solved via semi-analytical technique based on Laplace transformation. Dimensionless numerical results reveal that the decrease of the memory-dependent parameters of heat transport and strain lower the thermal wave propagation speed and reduce harmful stress and deformation in the SLSC. And the properly selecting parameters of laser intensity, pulse duration and semiconductor parameters ratios maximally improve the photo-thermo-mechanical impact responses and photo-thermal waves.

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激光诱导夹层半导体复合材料动态响应的分数阶光热弹性模型

激光加热技术作为一种新的超精密加工方法，在夹层半导体复合材料的微加工中得到了广泛的应用，其应变和热输运的记忆依赖性显著增强。为了准确预测SLSC在非高斯光束作用下的微尺度瞬态冲击响应，本文基于记忆依赖的应变和热输运演化规律，利用Atangana-Baleanu和tempere - caputo分数阶导数建立了新的cattaneo -光热弹性模型。该模型旨在分析记忆相关热输运和应变以及内层/外层材料参数比对SLSC光热弹性响应和波传播的影响。采用基于拉普拉斯变换的半解析方法求解一维多变量偏微分方程的时域解。无因次数值计算结果表明，热传递和应变记忆参数的减小降低了热波传播速度，减小了SLSC中的有害应力和变形。合理选择激光强度、脉冲持续时间和半导体参数比值等参数，可以最大程度地改善光-热-机械冲击响应和光-热波。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Silicon CHEMISTRY, PHYSICAL-MATERIALS SCIENCE, MULTIDISCIPLINARY

CiteScore

5.90

自引率

20.60%

发文量

685

审稿时长

>12 weeks

期刊介绍： The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.