Xiaoyi Yao, Dandan Wu, Chong Chen, Yuxuan Tian, Xingwei Yang
{"title":"Process Optimization and Leaching Behavior of Copper in Oxidation Leaching Spent Silicon Contact in Sulfuric Acid Systems","authors":"Xiaoyi Yao, Dandan Wu, Chong Chen, Yuxuan Tian, Xingwei Yang","doi":"10.1007/s12633-025-03362-z","DOIUrl":null,"url":null,"abstract":"<div><p>The current silicone industry is in a stage of rapid development, but the problem is that in the process of its development, a lot of silicone waste contacts have been generated, and the generation of this problem shows that there is a waste of resources. The rational utilization of organic silicon waste contacts which contains silicon and copper restricts the development of organic silicon industry. In consideration of the limited copper resources, it is of great significance to recover copper from the waste contacts. In this study, sodium hypochlorite was adopted as an oxidant to leach copper from spent silicon contacts under sulfuric acid system, and the leaching mechanism was studied in detail by various characterization methods (SEM–EDS, XPS, AFM), and kinetic analysis was also conducted. The effects of sodium hypochlorite concentration, sulfuric acid concentration, temperature and solid–liquid ratio on copper leaching efficiency were studied by two-factor experiments with time addition, and the leaching process was optimized. The experimental results show that the oxidative acid leaching method of sodium hypochlorite combined with sulfuric acid is more efficient and feasible than that of single sulfuric acid leaching, and the copper leaching rate reaches 97.55%, which is due to the fact that sodium hypochlorite will reduce the production of copper element. This study provides the feasibility of a new oxidant application for the recycling of waste silicon contact copper, which will facilitate the sustainable development of the silicone industry.</p></div>","PeriodicalId":776,"journal":{"name":"Silicon","volume":"17 11","pages":"2619 - 2634"},"PeriodicalIF":3.3000,"publicationDate":"2025-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Silicon","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12633-025-03362-z","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
The current silicone industry is in a stage of rapid development, but the problem is that in the process of its development, a lot of silicone waste contacts have been generated, and the generation of this problem shows that there is a waste of resources. The rational utilization of organic silicon waste contacts which contains silicon and copper restricts the development of organic silicon industry. In consideration of the limited copper resources, it is of great significance to recover copper from the waste contacts. In this study, sodium hypochlorite was adopted as an oxidant to leach copper from spent silicon contacts under sulfuric acid system, and the leaching mechanism was studied in detail by various characterization methods (SEM–EDS, XPS, AFM), and kinetic analysis was also conducted. The effects of sodium hypochlorite concentration, sulfuric acid concentration, temperature and solid–liquid ratio on copper leaching efficiency were studied by two-factor experiments with time addition, and the leaching process was optimized. The experimental results show that the oxidative acid leaching method of sodium hypochlorite combined with sulfuric acid is more efficient and feasible than that of single sulfuric acid leaching, and the copper leaching rate reaches 97.55%, which is due to the fact that sodium hypochlorite will reduce the production of copper element. This study provides the feasibility of a new oxidant application for the recycling of waste silicon contact copper, which will facilitate the sustainable development of the silicone industry.
期刊介绍:
The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.