Scratch-induced microstructure of Ni single crystal: A FIB-TEM study

IF 2.2 3区 工程技术 Q1 MICROSCOPY
Chenbang Zhu, Ying Chen, Keduo Xia, Liankui Wu, Fahe Cao, Qingqing Sun
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引用次数: 0

Abstract

Revealing the scratch-induced microstructural evolution of metals is important to establish the mechanism and model of wear and/or tribology. In this work, substructure evolution of the region between scratch track and the unaffected metal of Ni single crystal was fully characterized by using advanced electron microscopy techniques such as FIB, TEM and TKD. A 30 μm × 30 μm electron transparent foil at the area of interest was fabricated by FIB technique. Four ‌characteristic substructures are identified as approaching to the scratch track direction: Area I predominantly contains dislocation cells and dislocation tangles; Area II features refined dislocation cells and cell blocks; Area III comprises ultrafine grains (UFG); Area IV consists of nanolaminates (NL). This work provides key experimental basis for relevant simulations in the field of friction and wear.
Ni单晶划痕诱导微观结构的FIB-TEM研究
揭示金属划伤诱导的微观组织演化对建立磨损和摩擦学的机理和模型具有重要意义。本文利用FIB、TEM和TKD等先进的电子显微镜技术,对Ni单晶划痕与未受影响金属之间的亚结构演变进行了全面表征。利用FIB技术在目标区域制备了30 μm × 30 μm的电子透明薄膜。四个特征性亚结构接近划痕轨迹方向:区1主要包含位错胞和位错缠结;区域II的特征是精致的位错细胞和细胞块;区III包括超细颗粒(UFG);区域IV由纳米层合材料(NL)组成。该工作为摩擦磨损领域的相关模拟提供了重要的实验依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Micron
Micron 工程技术-显微镜技术
CiteScore
4.30
自引率
4.20%
发文量
100
审稿时长
31 days
期刊介绍: Micron is an interdisciplinary forum for all work that involves new applications of microscopy or where advanced microscopy plays a central role. The journal will publish on the design, methods, application, practice or theory of microscopy and microanalysis, including reports on optical, electron-beam, X-ray microtomography, and scanning-probe systems. It also aims at the regular publication of review papers, short communications, as well as thematic issues on contemporary developments in microscopy and microanalysis. The journal embraces original research in which microscopy has contributed significantly to knowledge in biology, life science, nanoscience and nanotechnology, materials science and engineering.
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