Status of Ga2O3 for power device and UV photodetector applications

Abstract

Gallium oxide (Ga2O3) has been the subject of extensive research over the past decade due to its potential in next-generation power electronics and solar-blind ultraviolet (UV) photodetectors. While Ga2O3 exhibits promising material characteristics for applications in harsh environments, its commercial viability remains under debate, particularly when compared to materials such as aluminum nitride (AlN) and diamond, which possess superior intrinsic properties. This perspective addresses the critical challenges that currently impede the widespread commercialization of Ga2O3-based devices. These challenges include a relatively immature technology base, the difficulty in achieving stable p-type conductivity, inherently low thermal conductivity, the presence of crystallographic defects (nano- and micro-voids), and elevated fabrication costs, all of which negatively impact device reliability and scalability. Mitigation strategies, such as heterojunction implementation, the development of thermal management solutions such as wafer bonding, and defect passivation approaches, are also under investigation. The near-term feasibility of commercially viable Ga2O3-based power electronic devices is a central focus of this discussion. The current status is that Ga2O3 development is far advanced relative to either diamond or especially AlN power electronics but is hampered by lack of a broad base of substrate vendors and a compelling vision for device implementations that provide sufficient improvement over SiC power devices. There are strong geographic differences in device focus, with China prioritizing implementation in grid applications while the United States/Europe appear to consider Ga2O3 devices more for defense and aerospace applications.