{"title":"Robotic transfer of 2D materials comes of age","authors":"Timothy John Booth, Peter Bøggild","doi":"10.1038/s44286-025-00221-x","DOIUrl":null,"url":null,"abstract":"The transfer of 2D materials from growth to device substrates has hampered their scalability. Now, a robotic, solvent-free process promises clean, high-yield and wafer-scale integration.","PeriodicalId":501699,"journal":{"name":"Nature Chemical Engineering","volume":"2 5","pages":"292-293"},"PeriodicalIF":0.0000,"publicationDate":"2025-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nature Chemical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.nature.com/articles/s44286-025-00221-x","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The transfer of 2D materials from growth to device substrates has hampered their scalability. Now, a robotic, solvent-free process promises clean, high-yield and wafer-scale integration.
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