Influence of Si content on cracking behavior of CrAlSiN coatings

IF 6.1 2区 材料科学 Q1 MATERIALS SCIENCE, COATINGS & FILMS
Kirsten Bobzin, Max Philip Möbius, Jessica Borowy
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引用次数: 0

Abstract

Physical Vapor Deposition (PVD) manufactured CrAlSiN nanocomposite coatings, composed of CrAlN grains in a SiNx matrix, represent a promising solution for improved cutting performance of milling tools. The elastic-plastic properties and deformation behavior of the material composite thereby can be deliberately influenced by varying the silicon content.
CrAlSiN coatings with silicon contents of xSi = 10, 16, 22, and 29 at.-% in the metal portion were fabricated on cemented carbide WC-Co substrates. The indentation hardness HIT and modulus EIT of the coatings were measured through nanoindentation, using a Berkovich indenter. Additionally, crack resistance was evaluated using high load (HL) nanoindentation tests under forces ranging from FHL = 750 to 1750 mN, using a conical diamond indenter. The findings reveal that the indentation hardness HIT remains unchanged at HIT = (25.5 ± 1.6) GPa, while the indentation modulus increases with higher silicon content. After high load nanoindentation all coatings exhibit no cracks at FHL = 750 mN. Initial cracks are observed at FHL = 1000 mN for xSi = 10 at.-%, whereas they appear at just FHL = 800 mN for xSi = 29 at.-%. With a further increase in load to FHL = 1750 mN, it is evident that the coating with a silicon content of xSi = 22 at.-% displays the fewest and shortest cracks.
Coatings with high silicon content therefore demonstrate promising crack resistance at room temperature even though the examination of indentation hardness and modulus does not support this behavior at first sight. This highlights their potential for further investigation, qualifying these coatings for additional studies under high-temperature conditions, aiming to enhance their applicability in machining processes.
Si含量对CrAlSiN涂层开裂行为的影响
物理气相沉积(PVD)制造的CrAlN纳米复合涂层,由CrAlN晶粒在SiNx基体中组成,代表了一种有前途的解决方案,可以改善铣刀的切削性能。因此,复合材料的弹塑性性能和变形行为可以通过改变硅含量而受到有意的影响。硅含量为xSi = 10、16、22和29 at的CrAlSiN涂层。金属部分-%在硬质合金WC-Co衬底上制备。采用纳米压痕仪测量了涂层的压痕硬度HIT和模量EIT。此外,使用锥形金刚石压头,在FHL = 750至1750 mN的力范围内,使用高载荷(HL)纳米压痕测试来评估抗裂性。结果表明:在HIT =(25.5±1.6)GPa时,压痕硬度HIT保持不变,而压痕模量随着硅含量的增加而增加。在高负荷压痕后,所有涂层在FHL = 750 mN时均无裂纹。当xSi = 10 at时,在FHL = 1000 mN处观察到初始裂纹。-%,而在xSi = 29 at.-%时,它们仅出现在FHL = 800 mN。当载荷进一步增加到FHL = 1750 mN时,可以明显地看出,硅含量为xSi = 22 at的涂层。-%表示裂缝最少、最短。因此,高硅含量的涂层在室温下表现出良好的抗裂性,尽管压痕硬度和模量的检查乍一看并不支持这种行为。这突出了其进一步研究的潜力,使这些涂层能够在高温条件下进行额外的研究,旨在提高其在机械加工过程中的适用性。
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来源期刊
Surface & Coatings Technology
Surface & Coatings Technology 工程技术-材料科学:膜
CiteScore
10.00
自引率
11.10%
发文量
921
审稿时长
19 days
期刊介绍: Surface and Coatings Technology is an international archival journal publishing scientific papers on significant developments in surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance. Contributions range from original scientific articles concerned with fundamental and applied aspects of research or direct applications of metallic, inorganic, organic and composite coatings, to invited reviews of current technology in specific areas. Papers submitted to this journal are expected to be in line with the following aspects in processes, and properties/performance: A. Processes: Physical and chemical vapour deposition techniques, thermal and plasma spraying, surface modification by directed energy techniques such as ion, electron and laser beams, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting. B. Properties/performance: friction performance, wear resistance (e.g., abrasion, erosion, fretting, etc), corrosion and oxidation resistance, thermal protection, diffusion resistance, hydrophilicity/hydrophobicity, and properties relevant to smart materials behaviour and enhanced multifunctional performance for environmental, energy and medical applications, but excluding device aspects.
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