Cong Chen , Junyi Liu , Xiaoshan Liu , Guiqiang Liu , Guolan Fu , Jing Chen , Wei Du , Chaojun Tang , Juan Deng , Zhengqi Liu
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引用次数: 0
Abstract
All-dielectric metasurfaces have become a popular platform for mid-infrared molecular fingerprint detection. However, since the absorption rate of the two-port leaky mode system can only reach a maximum of 0.5, this limits the contrast of the absorbed signal. In this work, we propose an all-dielectric quasi-bound states in the continuum (quasi-BIC) metasurface and realize mid-infrared molecular fingerprint detection based on the extinction coefficient of the substances being detected on the transmission of quasi-BIC. Using boron carbide (B4C) as an example, we successfully measure its mid-infrared molecular fingerprint spectrum and achieve satisfactory results within nm-scale films. Additionally, it also demonstrates excellent sensing performance, with a sensitivity (S) up to 927.5 nm/RIU and a figure of merit (FOM) value of 98670.21/RIU, enabling the detection of sodium chloride (NaCl) solution concentration differences as low as 0.009 % and Bovine Serum Albumin (BSA) solution concentration differences as low as 0.005 %. These results indicate the potential application of our metasurface in mid-infrared fingerprint detection and solution sensing.
期刊介绍:
Optics Communications invites original and timely contributions containing new results in various fields of optics and photonics. The journal considers theoretical and experimental research in areas ranging from the fundamental properties of light to technological applications. Topics covered include classical and quantum optics, optical physics and light-matter interactions, lasers, imaging, guided-wave optics and optical information processing. Manuscripts should offer clear evidence of novelty and significance. Papers concentrating on mathematical and computational issues, with limited connection to optics, are not suitable for publication in the Journal. Similarly, small technical advances, or papers concerned only with engineering applications or issues of materials science fall outside the journal scope.