Numerical study of thermal structure of dielectrophoretic cell-separation microfluidic device created by heat generation

IF 5.4 3区工程技术 Q2 ENERGY & FUELS

Thermal Science and Engineering Progress Pub Date : 2025-09-10 DOI:10.1016/j.tsep.2025.104087

Shigeru Tada

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Abstract

Cell separation technology using dielectrophoresis (DEP) has attracted much interest as an effective method for noninvasive cell separation. However, in cell separation devices that use DEP, cells in the device are exposed to a high-temperature environment due to the generation of Joule heat by the application of high voltage and to dielectric loss heat when AC voltage is applied. There is concern that the heat generated in the device may affect cell viability, the cell cycle, and apoptosis induction. In this study, we investigated the thermal structure of an AC DEP cell separation device assuming the actual device geometry and operating conditions. Numerical simulations of thermofluid dynamics adopting a heat generation model that took into account Joule heat and dielectric loss heat were performed to evaluate the temperature rise inside the device when a low-conductivity solution is used. The results demonstrated that the average temperature rise at the bottom surface of the device’s microchannel was about 11 ℃ at the maximum. However, it was shown that the average temperature rise was approximately 6 ℃ under the operating conditions of the device that gave the highest cell separation ratio. This suggests that as long as a low-conductivity solution is used for cell suspension, the thermal effect on the cells is small.

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热生成介质电泳细胞分离微流控装置热结构的数值研究

介质电泳（DEP）作为一种有效的无创细胞分离方法，已引起人们的广泛关注。然而，在使用DEP的电池分离装置中，由于施加高压产生焦耳热，以及施加交流电压时产生介电损耗热，设备中的电池暴露在高温环境中。人们担心装置中产生的热量可能影响细胞活力、细胞周期和细胞凋亡诱导。在本研究中，我们研究了假设实际器件几何形状和操作条件的交流DEP电池分离装置的热结构。采用考虑焦耳热和介电损耗热的热生成模型进行热流体动力学数值模拟，以评估使用低电导率溶液时器件内部的温升。结果表明，器件微通道底表面的平均温升最高可达11℃左右。结果表明，在该装置运行条件下，平均温升约为6℃，电池分离率最高。这表明，只要使用低电导率溶液作为细胞悬浮液，对细胞的热效应就很小。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

7.20

自引率

10.40%

发文量

327

审稿时长

41 days

期刊介绍： Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.