Song Liu , Shaolin Li , Kexing Song , Xiaowen Peng , Xiuhua Guo , Zhenhan Zhou , Shuaibin Li , Fuxiao Chen
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引用次数: 0
Abstract
Overcoming the strength–conductivity trade-off in Al2O3/Cu composites remains a key challenge. Here, we propose a microstructural design strategy that combines 〈0 0 1〉 texture with elongated ultrafine grains. Room-temperature rotary swaging (RS), assisted by the pinning effect of Al2O3 particles, promotes the selective formation of 〈0 0 1〉-oriented grains through compressive–shear deformation and enhances grain aspect ratios. The resulting structure provides texture-dominated conductive paths while reducing transverse grain boundary density. Consequently, the composite achieves a yield strength of 342 MPa and an electrical conductivity of 95.3 % IACS—representing a 56.8 % strength increase over the Cu matrix without sacrificing conductivity. This work demonstrates a scalable, room-temperature route to high-performance Cu-based composites with an exceptional strength–conductivity balance for advanced electrical applications.
期刊介绍:
Materials and Design is a multi-disciplinary journal that publishes original research reports, review articles, and express communications. The journal focuses on studying the structure and properties of inorganic and organic materials, advancements in synthesis, processing, characterization, and testing, the design of materials and engineering systems, and their applications in technology. It aims to bring together various aspects of materials science, engineering, physics, and chemistry.
The journal explores themes ranging from materials to design and aims to reveal the connections between natural and artificial materials, as well as experiment and modeling. Manuscripts submitted to Materials and Design should contain elements of discovery and surprise, as they often contribute new insights into the architecture and function of matter.