Microcellular TLCP/SiO2 for high-frequency communication design

Abstract

With the development of high-frequency and high-speed communication technologies, especially in microwave/millimeter-wave applications, electronic devices face increased performance demands. Developing low dielectric materials with exceptional properties for these devices has become a significant challenge. Thermotropic liquid crystal polymers (TLCP) are promising due to their excellent high-frequency performance, while microcellular foaming technology is commonly used to enhance dielectric properties. In this study, TLCP was modified with ADR and nano-SiO₂. The synergistic modification introduces long-chain branched structures and nucleation sites, improving matrix performance and optimizing foaming behavior. In addition, long-chain branched TLCP/SiO₂ foam has highly compressive properties, excellent dimensional stability, ultra-low dielectric stability at high frequencies, great flame retardant and wonderful high-temperature infrared thermal stealth performance. It is also found by simulation that the patch antenna with long-chain branched TLCP/SiO₂ foam substrate has excellent signal transmission performance. The transmission distance up to 4793 m, which is 5.8 times higher than pure TLCP before foaming, which presents a novel solution for high-frequency and high-speed communication. Furthermore, the long-chain branched TLCP/SiO₂ foams with significant performance is expected to be used in sophisticated technology fields such as wide-ranging applications in military, extreme conditions, aviation, microelectronic and other fields.