Corrosion-resistant and heat-dissipative SiOC ultralight lattice for high-temperature EMI shielding

IF 11.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING
Shixiang Zhou , Yijing Zhao , Xiao Guo , Udeshwari Jamwal , Pon Janani Sugumaran , Sreekanth Ginnaram , Wentao Yan , Jun Ding , Yong Yang
{"title":"Corrosion-resistant and heat-dissipative SiOC ultralight lattice for high-temperature EMI shielding","authors":"Shixiang Zhou ,&nbsp;Yijing Zhao ,&nbsp;Xiao Guo ,&nbsp;Udeshwari Jamwal ,&nbsp;Pon Janani Sugumaran ,&nbsp;Sreekanth Ginnaram ,&nbsp;Wentao Yan ,&nbsp;Jun Ding ,&nbsp;Yong Yang","doi":"10.1016/j.addma.2025.104964","DOIUrl":null,"url":null,"abstract":"<div><div>High-temperature electromagnetic interference (EMI) shielding material is essential for intense thermal or electromagnetic radiation applications. Ceramics are promising candidates but are often fabricated with increased density and thickness to achieve sufficient shielding effectiveness (SE). However, we present an unconventional strategy to enhance the SE of ceramics by reducing density realized through hierarchical lattice design. 3D-printed silicon oxycarbide (SiOC) with self-arrayed and corrosion-resistant carbon nanosheets was employed to materialize this design. As the density decreases from 2.73 to 0.53 g/cm<sup>3</sup>, the SE increases from 12.53 to 27.27 dB. The combined effects of densely arrayed carbon nanosheets and hierarchical design amplify multi-reflection/scattering, enabling enhanced EMI shielding at reduced density. Furthermore, this structure is capable of operation at 600 °C and oxygen corrosion environment even at an ultralow density of 0.29 g/cm<sup>3</sup>, achieving over 99 % shielding efficiency. It exhibits a low thermal expansion coefficient of 1.41 × 10<sup>−6</sup>/K at 600 °C, along with compressive strength, Young’s modulus, and energy absorption of 6.38 MPa, 3.02 GPa, and 8.14 kJ/cm<sup>3</sup>, respectively, ensuring mechanical, dimensional, and shielding robustness. The interconnected hollow spaces and exposed surfaces facilitate both active and passive heat dissipation, preventing thermal failure and extending the operational lifespan. Under airflow, the heated structure cools to 46.6 °C within 25 s, effectively reducing the operating temperature. This strategy provides a straightforward approach for fabricating high-temperature and lightweight EMI shielding ceramics through structural optimization, underscoring its potential for performance enhancement, cost reduction, and application expansion for extreme environments.</div></div>","PeriodicalId":7172,"journal":{"name":"Additive manufacturing","volume":"111 ","pages":"Article 104964"},"PeriodicalIF":11.1000,"publicationDate":"2025-08-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Additive manufacturing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2214860425003288","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
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Abstract

High-temperature electromagnetic interference (EMI) shielding material is essential for intense thermal or electromagnetic radiation applications. Ceramics are promising candidates but are often fabricated with increased density and thickness to achieve sufficient shielding effectiveness (SE). However, we present an unconventional strategy to enhance the SE of ceramics by reducing density realized through hierarchical lattice design. 3D-printed silicon oxycarbide (SiOC) with self-arrayed and corrosion-resistant carbon nanosheets was employed to materialize this design. As the density decreases from 2.73 to 0.53 g/cm3, the SE increases from 12.53 to 27.27 dB. The combined effects of densely arrayed carbon nanosheets and hierarchical design amplify multi-reflection/scattering, enabling enhanced EMI shielding at reduced density. Furthermore, this structure is capable of operation at 600 °C and oxygen corrosion environment even at an ultralow density of 0.29 g/cm3, achieving over 99 % shielding efficiency. It exhibits a low thermal expansion coefficient of 1.41 × 10−6/K at 600 °C, along with compressive strength, Young’s modulus, and energy absorption of 6.38 MPa, 3.02 GPa, and 8.14 kJ/cm3, respectively, ensuring mechanical, dimensional, and shielding robustness. The interconnected hollow spaces and exposed surfaces facilitate both active and passive heat dissipation, preventing thermal failure and extending the operational lifespan. Under airflow, the heated structure cools to 46.6 °C within 25 s, effectively reducing the operating temperature. This strategy provides a straightforward approach for fabricating high-temperature and lightweight EMI shielding ceramics through structural optimization, underscoring its potential for performance enhancement, cost reduction, and application expansion for extreme environments.
耐腐蚀和散热SiOC超轻晶格高温电磁干扰屏蔽
高温电磁干扰(EMI)屏蔽材料对于强热或强电磁辐射应用是必不可少的。陶瓷是很有前途的候选材料,但为了获得足够的屏蔽效果,通常需要增加密度和厚度。然而,我们提出了一种非常规的策略,通过降低通过分层晶格设计实现的密度来提高陶瓷的SE。采用自排列和耐腐蚀碳纳米片的3d打印碳化硅(SiOC)来实现该设计。随着密度从2.73降低到0.53 g/cm3, SE从12.53增加到27.27 dB。密集排列的碳纳米片和分层设计的综合效应放大了多重反射/散射,从而在降低密度时增强了EMI屏蔽。此外,该结构能够在600°C和氧腐蚀环境下工作,即使在0.29 g/cm3的超低密度下,也能实现99% %以上的屏蔽效率。在600℃时,它的热膨胀系数为1.41 × 10−6/K,抗压强度、杨氏模量和能量吸收分别为6.38 MPa、3.02 GPa和8.14 kJ/cm3,确保了机械、尺寸和屏蔽的鲁棒性。相互连接的中空空间和暴露的表面有利于主动和被动散热,防止热失效并延长使用寿命。在气流作用下,加热结构在25 s内冷却至46.6℃,有效降低了工作温度。该策略通过结构优化为制造高温轻质EMI屏蔽陶瓷提供了一种简单的方法,强调了其在性能增强、成本降低和极端环境应用扩展方面的潜力。
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来源期刊
Additive manufacturing
Additive manufacturing Materials Science-General Materials Science
CiteScore
19.80
自引率
12.70%
发文量
648
审稿时长
35 days
期刊介绍: Additive Manufacturing stands as a peer-reviewed journal dedicated to delivering high-quality research papers and reviews in the field of additive manufacturing, serving both academia and industry leaders. The journal's objective is to recognize the innovative essence of additive manufacturing and its diverse applications, providing a comprehensive overview of current developments and future prospects. The transformative potential of additive manufacturing technologies in product design and manufacturing is poised to disrupt traditional approaches. In response to this paradigm shift, a distinctive and comprehensive publication outlet was essential. Additive Manufacturing fulfills this need, offering a platform for engineers, materials scientists, and practitioners across academia and various industries to document and share innovations in these evolving technologies.
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