Jin Wang , Ruguang Zhang , Wenfeng Li , Yongjun Wang , Ming Hao , Kun Liu , Yuanhua Xie , Huzhong Zhang , Chengdan He , Yan Zhang , Detian Li , Zhenlin Wang
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引用次数: 0
Abstract
Deep space exploration missions critically require reliable sealing system for extraterrestrial sample containment and return. This study presents a Shape Memory Alloy-based Knife-edge Seal System (SMAKSS) designed specifically for this demanding application. Through an integrated approach combining numerical modeling and experimental validation, we systematically investigated the system's sealing performance. A thermo-mechanical finite element model is developed in COMSOL Multiphysics to simulate the Shape Memory Alloy (SMA) ring's thermally-induced contraction behavior and stress distribution during sealing. Moreover, the experiment investigates trends in both leakage rates and knife-edge penetration depths in SMAKSS systems with four different blade angles and tip radius under increasing heating temperatures. Experimental results demonstrate that the configuration with a 45° blade angle and a 0.1 mm tip radius achieves the deepest penetration depth and generates the highest compressive stress, achieving a minimal leakage rate of 3.53 × 10−11 Pa m3/s at a heating temperature of 150 °C. This leakage rate meets the stringent sealing requirements for extraterrestrial sample containment, establishing SMAKSS as a promising solution for planetary exploration applications.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.