Comprehensive analysis of geometric and thermohydraulic characteristics in single-embossed channels of pillow-plate heat exchangers

IF 2.6 3区工程技术 Q2 ENGINEERING, MECHANICAL

International Journal of Heat and Fluid Flow Pub Date : 2025-09-17 DOI:10.1016/j.ijheatfluidflow.2025.110068

Amirhossein Sabourishirazi, Jong-Leng Liow, Maryam Ghodrat

{"title":"Comprehensive analysis of geometric and thermohydraulic characteristics in single-embossed channels of pillow-plate heat exchangers","authors":"Amirhossein Sabourishirazi, Jong-Leng Liow, Maryam Ghodrat","doi":"10.1016/j.ijheatfluidflow.2025.110068","DOIUrl":null,"url":null,"abstract":"<div><div>This study investigated the geometric and thermohydraulic characteristics of flat- and curve-type single-embossed pillow-plate channels (SEPPCs) elaborately for the first time. These examinations revealed that estimating mean hydraulic diameters (MHDs) in various SEPPCs remains a significant challenge, primarily due to the intricate channel structures. Additionally, assuming identical constant wall temperatures for the thinner and thicker plates of SEPPCs causes thermal uncertainties regarding the influence of conduction heat transfer in these plates. This research addresses these challenges in stainless steel, aluminum, and copper SEPPCs. A procedure for hydroforming simulation based on the finite element method was established to model the structure of SEPPCs reliably. By defining novel dimensionless parameters, improved MHD correlations were developed with estimation errors of 13.54 % and −8.68 % for flat- and curve-type SEPPCs, respectively, compared to simulation results. Compared to existing methods, these correlations improved MHD estimations and identified the MHD extremums. Conjugate heat transfer simulations were applied to study heat transfer in the plates of SEPPCs, revealing how material properties, geometric configurations, and fluid convection shaped temperature distributions. Analysis of the periodic-bulk-temperature ratio revealed that simulations using constant wall temperatures were insufficient to accurately represent the behavior of SEPPCs. Moreover, the development of optimized artificial neural networks facilitated the evaluation of the contributing parameters and resulted in accurate predictions of MHDs in both flat- and curve-type SEPPCs, as well as the average channel plate temperatures in flat-type SEPPCs. The findings of this study on MHD estimations and the critical role of channel wall temperatures offer a solid foundation for advancing research across diverse SEPPC configurations in the future.</div></div>","PeriodicalId":335,"journal":{"name":"International Journal of Heat and Fluid Flow","volume":"117 ","pages":"Article 110068"},"PeriodicalIF":2.6000,"publicationDate":"2025-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Heat and Fluid Flow","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0142727X25003261","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}

引用次数: 0

Abstract

This study investigated the geometric and thermohydraulic characteristics of flat- and curve-type single-embossed pillow-plate channels (SEPPCs) elaborately for the first time. These examinations revealed that estimating mean hydraulic diameters (MHDs) in various SEPPCs remains a significant challenge, primarily due to the intricate channel structures. Additionally, assuming identical constant wall temperatures for the thinner and thicker plates of SEPPCs causes thermal uncertainties regarding the influence of conduction heat transfer in these plates. This research addresses these challenges in stainless steel, aluminum, and copper SEPPCs. A procedure for hydroforming simulation based on the finite element method was established to model the structure of SEPPCs reliably. By defining novel dimensionless parameters, improved MHD correlations were developed with estimation errors of 13.54 % and −8.68 % for flat- and curve-type SEPPCs, respectively, compared to simulation results. Compared to existing methods, these correlations improved MHD estimations and identified the MHD extremums. Conjugate heat transfer simulations were applied to study heat transfer in the plates of SEPPCs, revealing how material properties, geometric configurations, and fluid convection shaped temperature distributions. Analysis of the periodic-bulk-temperature ratio revealed that simulations using constant wall temperatures were insufficient to accurately represent the behavior of SEPPCs. Moreover, the development of optimized artificial neural networks facilitated the evaluation of the contributing parameters and resulted in accurate predictions of MHDs in both flat- and curve-type SEPPCs, as well as the average channel plate temperatures in flat-type SEPPCs. The findings of this study on MHD estimations and the critical role of channel wall temperatures offer a solid foundation for advancing research across diverse SEPPC configurations in the future.

查看原文本刊更多论文

枕板式换热器单压花通道几何及热水力特性综合分析

本文首次对平面型和曲线型单压花枕板通道（SEPPCs）的几何和热水力特性进行了详细的研究。这些研究表明，估计各种seppc的平均水力直径（mhd）仍然是一个重大挑战，主要是由于复杂的通道结构。此外，假设SEPPCs的薄板和厚板的壁温相同，会导致这些板中导热传热影响的热不确定性。本研究解决了不锈钢、铝和铜seppc中的这些挑战。建立了一种基于有限元法的液压成形仿真程序，对SEPPCs的结构进行了可靠的建模。通过定义新的无量纲参数，与模拟结果相比，平坦型和曲线型seppc的MHD相关性得到了改进，估计误差分别为13.54%和- 8.68%。与现有方法相比，这些相关性改进了MHD估计并确定了MHD极值。应用共轭传热模拟方法研究了SEPPCs板内的传热，揭示了材料性质、几何构型和流体对流对温度分布的影响。对周期性体积温度比的分析表明，使用恒定壁温的模拟不足以准确表征SEPPCs的行为。此外，优化的人工神经网络的发展促进了贡献参数的评估，从而准确预测了平面型和曲线型SEPPCs的mhd以及平面型SEPPCs的平均通道板温度。本研究的MHD估算结果和通道壁温度的关键作用为未来推进不同SEPPC配置的研究奠定了坚实的基础。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

International Journal of Heat and Fluid Flow 工程技术-工程：机械

CiteScore

5.00

自引率

7.70%

发文量

131

审稿时长

33 days

期刊介绍： The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.