Pick-and-Place Grippers with Tunable Adhesion from Capped Soft Hollow Pillar Structure

IF 6.4 3区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Yanbing Tang, Farshad Goodarzi, Guangchao Wan, Wanliang Shan
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引用次数: 0

Abstract

Dynamically tunable dry adhesion has numerous applications in biological systems and industrial processes. Soft hollow pillars (SHPs) have demonstrated to have exceptional adhesion tunability under pneumatic actuation through sidewall buckling or bulging mechanisms. However, the adhesion strength of SHPs is significantly lower than that of solid elastomeric pillars, which can limit their practical use. In this study, mushroom-shaped SHPs with a mushroom cap, or capped SHPs (C-SHPs), are introduced to enhance the adhesion performance of soft grippers based on hollow pillar structures. Experiments and finite element modeling demonstrate that the cap significantly improves adhesion strength (1.8 to 2.9×) and adhesion tunability (∼1000×) by optimizing stress distribution and altering the crack initiation process at the contact interface. The effect of the cap size on the adhesion strength of C-SHPs under various pressures is systematically investigated. Miniaturized SHPs and C-SHPs are fabricated for pick-and-place manipulation of lightweight objects. An untethered device containing a C-SHP is designed and assembled to highlight the energy-efficient operation of C-SHPs, with a ∼139 mJ energy consumption per pick-and-place cycle, showcasing their potential for applications in precision handling tasks. This work establishes C-SHPs as a robust and adaptable solution for tunable dry adhesion systems.

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拾取和放置夹持器可调附着力从封顶软空心支柱结构
动态可调干附着力在生物系统和工业过程中有许多应用。软空心柱(SHPs)已被证明在气动驱动下通过侧壁屈曲或胀形机制具有特殊的粘附可调性。然而,SHPs的粘接强度明显低于固体弹性柱,这限制了其实际应用。在本研究中,引入蘑菇形状的蘑菇帽SHPs,或封顶SHPs (C-SHPs),以提高基于空心柱结构的软夹持器的粘附性能。实验和有限元模拟表明,通过优化应力分布和改变接触界面处的裂纹起裂过程,该帽显著提高了粘接强度(1.8 ~ 2.9 x)和粘接可调性(~ 1000x)。系统地研究了不同压力下,帽形尺寸对C-SHPs粘接强度的影响。小型化的shp和c - shp是为轻质物体的拾取和放置操作而制造的。设计和组装了一个包含C-SHP的非系绳设备,以突出C-SHP的节能运行,每个拾取和放置周期的能耗约为139兆焦尔,展示了它们在精确处理任务中的应用潜力。这项工作建立了C-SHPs作为可调干粘附系统的鲁棒性和适应性解决方案。
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来源期刊
Advanced Materials Technologies
Advanced Materials Technologies Materials Science-General Materials Science
CiteScore
10.20
自引率
4.40%
发文量
566
期刊介绍: Advanced Materials Technologies Advanced Materials Technologies is the new home for all technology-related materials applications research, with particular focus on advanced device design, fabrication and integration, as well as new technologies based on novel materials. It bridges the gap between fundamental laboratory research and industry.
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