Jun Zhang;Liu Tao;Xuan Xie;Bei Huang;Yaya Song;Lihong Dong;Haidou Wang
{"title":"Research on Quantitative Circuit Model and Detection of Crack Based on Microstrip Line Structure","authors":"Jun Zhang;Liu Tao;Xuan Xie;Bei Huang;Yaya Song;Lihong Dong;Haidou Wang","doi":"10.1109/TIM.2025.3609373","DOIUrl":null,"url":null,"abstract":"Fatigue cracks and other forms of damage can have a significant impact on the normal operation of metal facilities, necessitating the deployment of multiple sensors for monitoring within large structures. The arrangement of these sensors must take into account factors such as the shape, size, and complexity of the monitoring area, as well as the optimal positioning and spacing of sensor nodes. This requirement for comprehensive coverage while minimizing costs presents considerable challenges for structural health monitoring (SHM) techniques. In this article, the feasibility of crack detection with a simple microstrip line (ML) is studied in the millimeter-wave band. The detection sensitivity is 0.283/mm2, the precision is 13.61%, and the minimum crack depth that can be identified is 0.2 mm (when crack width <inline-formula> <tex-math>$\\ge 1.0$ </tex-math></inline-formula> mm). An equivalent circuit model for this type of traveling-wave sensor is established in conjunction with field analysis, and the accuracy of the model is verified by comparing full-wave simulation and the circuit model. The proposed sensor can act as a distributed sensor for the SHM applications.","PeriodicalId":13341,"journal":{"name":"IEEE Transactions on Instrumentation and Measurement","volume":"74 ","pages":"1-8"},"PeriodicalIF":5.9000,"publicationDate":"2025-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Instrumentation and Measurement","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11162625/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Fatigue cracks and other forms of damage can have a significant impact on the normal operation of metal facilities, necessitating the deployment of multiple sensors for monitoring within large structures. The arrangement of these sensors must take into account factors such as the shape, size, and complexity of the monitoring area, as well as the optimal positioning and spacing of sensor nodes. This requirement for comprehensive coverage while minimizing costs presents considerable challenges for structural health monitoring (SHM) techniques. In this article, the feasibility of crack detection with a simple microstrip line (ML) is studied in the millimeter-wave band. The detection sensitivity is 0.283/mm2, the precision is 13.61%, and the minimum crack depth that can be identified is 0.2 mm (when crack width $\ge 1.0$ mm). An equivalent circuit model for this type of traveling-wave sensor is established in conjunction with field analysis, and the accuracy of the model is verified by comparing full-wave simulation and the circuit model. The proposed sensor can act as a distributed sensor for the SHM applications.
期刊介绍:
Papers are sought that address innovative solutions to the development and use of electrical and electronic instruments and equipment to measure, monitor and/or record physical phenomena for the purpose of advancing measurement science, methods, functionality and applications. The scope of these papers may encompass: (1) theory, methodology, and practice of measurement; (2) design, development and evaluation of instrumentation and measurement systems and components used in generating, acquiring, conditioning and processing signals; (3) analysis, representation, display, and preservation of the information obtained from a set of measurements; and (4) scientific and technical support to establishment and maintenance of technical standards in the field of Instrumentation and Measurement.