IBM Telum II Microprocessor: 5.5 GHz With On-Die AI and Data Processing, and Design–Technology Co-Optimizations for Power, Area, and Reliability

IF 5.6 1区工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Journal of Solid-state Circuits Pub Date : 2025-09-18 DOI:10.1109/jssc.2025.3604370

Gerald Strevig, David Wolpert, Leon Sigal, Bill Huott, Mark Cichanowski, Noam Jungmann, Michael Sperling, Michael Becht, Matthias Pflanz, Daniel Kiss, Simon Büchsenstein, Tobias Werner, Philipp Salz, Michael Romain, Richard Serton, Nick Jing, Rajesh Veerabhadraiah, Dureseti Chidambarrao, Robert Arelt, Matt Angyal, Ben Trombley, Arvind Haran, Rahul M. Rao, Christopher Berry, Amanda Venton, Elazar Kachir, Andreas Arp

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IBM Telum II微处理器：5.5 GHz与芯片上的人工智能和数据处理，以及设计技术的共同优化功率，面积和可靠性

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来源期刊

IEEE Journal of Solid-state Circuits 工程技术-工程：电子与电气

CiteScore

11.00

自引率

20.40%

发文量

351

审稿时长

3-6 weeks

期刊介绍： The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.