M. Grédiac, F. Sur, A. Vinel, T. Jailin, B. Blaysat
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引用次数: 0
Abstract
Background
Reliably predicting the metrological performance of full-field measurement systems is a topical issue in the photomechanics community.
Objective
The objective of this paper is to propose predictive equations giving the pixelwise standard deviation distribution of the noise affecting displacement and strain maps retrieved from checkerboard patterns with the Localized Spectrum Analysis (LSA).
Methods
Predictive equations already available for the noise in phase distributions are employed to deduce their counterparts for the noise in displacement and strain maps. Two procedures are proposed to improve the reliability of the predictive equations. One is based on filtering the pseudo-periodic signal-dependent component of the noise, the other on the Generalized Anscombe Transform GAT, which stabilizes image noise variance, and thus leads to a better match of one of the assumptions under which the predictive equations are obtained.
Results
The predictive equations given in this paper are validated with synthetic and experimental data.
Conclusions
The predictive equations proposed here enable us to reliably predict image noise propagation to displacement and strain maps retrieved from checkerboard pattern images by LSA.
期刊介绍:
Experimental Mechanics is the official journal of the Society for Experimental Mechanics that publishes papers in all areas of experimentation including its theoretical and computational analysis. The journal covers research in design and implementation of novel or improved experiments to characterize materials, structures and systems. Articles extending the frontiers of experimental mechanics at large and small scales are particularly welcome.
Coverage extends from research in solid and fluids mechanics to fields at the intersection of disciplines including physics, chemistry and biology. Development of new devices and technologies for metrology applications in a wide range of industrial sectors (e.g., manufacturing, high-performance materials, aerospace, information technology, medicine, energy and environmental technologies) is also covered.