{"title":"Simulation and experimental study on the properties of Y- and Ce-doped AgSnO2 electrical contact materials","authors":"Jingqin Wang, Yuxuan Wang, Yihong Lv, Yancai Zhu, Ying Zhang","doi":"10.1007/s10854-025-15758-z","DOIUrl":null,"url":null,"abstract":"<div><p>AgSnO<sub>2</sub> contact materials have become a hot topic of research due to their excellent performance and are widely used in various low-voltage electrical appliances. To further improve the performance of AgSnO<sub>2</sub> and appropriately reduce the silver content in the material to achieve silver-saving effects, introducing appropriate doping into the material is one solution. In this study, first-principles calculations were used to establish interface models for undoped AgSnO<sub>2</sub> with 88% silver content and AgSnO<sub>2</sub> doped with Y and Ce at 85.5% silver content. It was found that doping enhances the interface bonding of AgSnO<sub>2</sub> and optimizes its electronic structure. AgSnO<sub>2</sub> contact materials were prepared using the sol–gel method and powder metallurgy, and their wettability and electrical contact performance were tested. The erosion morphology of the materials was also analyzed. The results showed that although the silver content in the contacts was reduced, doping could still enhance the material’s resistance to arc erosion, with Y-doped contact materials showing the most significant improvement, thereby validating the rationality of the simulation analysis results.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 26","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-09-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-15758-z","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
AgSnO2 contact materials have become a hot topic of research due to their excellent performance and are widely used in various low-voltage electrical appliances. To further improve the performance of AgSnO2 and appropriately reduce the silver content in the material to achieve silver-saving effects, introducing appropriate doping into the material is one solution. In this study, first-principles calculations were used to establish interface models for undoped AgSnO2 with 88% silver content and AgSnO2 doped with Y and Ce at 85.5% silver content. It was found that doping enhances the interface bonding of AgSnO2 and optimizes its electronic structure. AgSnO2 contact materials were prepared using the sol–gel method and powder metallurgy, and their wettability and electrical contact performance were tested. The erosion morphology of the materials was also analyzed. The results showed that although the silver content in the contacts was reduced, doping could still enhance the material’s resistance to arc erosion, with Y-doped contact materials showing the most significant improvement, thereby validating the rationality of the simulation analysis results.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.