Simulation and experimental study on the properties of Y- and Ce-doped AgSnO2 electrical contact materials

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jingqin Wang, Yuxuan Wang, Yihong Lv, Yancai Zhu, Ying Zhang
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引用次数: 0

Abstract

AgSnO2 contact materials have become a hot topic of research due to their excellent performance and are widely used in various low-voltage electrical appliances. To further improve the performance of AgSnO2 and appropriately reduce the silver content in the material to achieve silver-saving effects, introducing appropriate doping into the material is one solution. In this study, first-principles calculations were used to establish interface models for undoped AgSnO2 with 88% silver content and AgSnO2 doped with Y and Ce at 85.5% silver content. It was found that doping enhances the interface bonding of AgSnO2 and optimizes its electronic structure. AgSnO2 contact materials were prepared using the sol–gel method and powder metallurgy, and their wettability and electrical contact performance were tested. The erosion morphology of the materials was also analyzed. The results showed that although the silver content in the contacts was reduced, doping could still enhance the material’s resistance to arc erosion, with Y-doped contact materials showing the most significant improvement, thereby validating the rationality of the simulation analysis results.

Y掺杂和ce掺杂AgSnO2电接触材料性能的模拟与实验研究
AgSnO2触点材料因其优异的性能而成为研究热点,广泛应用于各种低压电器中。为了进一步提高AgSnO2的性能,并适当降低材料中的银含量以达到节约银的效果,在材料中引入适当的掺杂是一种解决方案。本研究采用第一性原理计算建立了银含量为88%的未掺杂AgSnO2和银含量为85.5%的Y和Ce掺杂AgSnO2的界面模型。发现掺杂增强了AgSnO2的界面键合,优化了其电子结构。采用溶胶-凝胶法和粉末冶金法制备了AgSnO2接触材料,并对其润湿性和电接触性能进行了测试。对材料的侵蚀形貌进行了分析。结果表明,虽然降低了触点中银的含量,但掺杂仍然可以增强材料的抗电弧侵蚀能力,其中y掺杂触点材料的改善效果最为显著,从而验证了仿真分析结果的合理性。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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