In Situ CT of Clinch Points – Enhancing Interface Detectability Using Electroplated Patterns of Radiopaque Materials

IF 2.4 3区 材料科学 Q2 MATERIALS SCIENCE, CHARACTERIZATION & TESTING
Daniel Köhler, Alrik Dargel, Juliane Troschitz, Maik Gude, Robert Kupfer
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引用次数: 0

Abstract

A clinch point’s quality is usually assessed using ex situ destructive testing methods. These, however, are unable to detect phenomena immediately during the joining process. For instance, elastic deformations reverse and cracks close after unloading. In situ methods such as the force-displacement evaluation are used to investigate a clinching process, though deviations in the clinch point geometry cannot be derived with this method. To overcome these limitations, the clinching process can be investigated using in situ computed tomography (in situ CT). When investigating the clinching of aluminum parts in in situ CT, the sheet-sheet interface is hardly visible. Earlier investigations showed that radiopaque materials can be applied between the joining parts to enhance the detectability of the sheet-sheet interface. However, the layers cause strong artefacts, break during the clinching process or change the clinch joint’s properties significantly. In this paper, a minimally invasive method to enhance the interface detectability is presented. First, the aluminum oxide layer is removed by etching. Second, the specimen is electroplated with copper or gold, respectively. In some cases, a mask is applied to create a cross-shaped plating pattern. Then, the plated specimen is clinched with a non-plated counterpart and the interface detectability of the clinch points is assessed in CT scans. It is shown that a copper plating of 2.6–4 μm can visualize some parts of the interface, while 7–9 μm is suitable to enhance the detectability of the sheet-sheet interface almost continuously.

固定点的原位CT -利用不透射线材料的电镀模式增强界面可探测性
固定点的质量通常采用非原位破坏性测试方法进行评估。然而,这些都不能在接合过程中立即检测到现象。例如,卸载后,弹性变形逆转,裂缝闭合。在原位方法,如力-位移评估被用来研究一个咬合过程,虽然在咬合点几何上的偏差不能用这种方法推导出来。为了克服这些限制,可以使用原位计算机断层扫描(in situ CT)来研究咬合过程。在原位CT中研究铝件的夹紧时,几乎看不到板材界面。早期的研究表明,可以在连接部分之间应用不透射线材料,以提高薄片界面的可探测性。然而,这些层会产生强烈的伪影,在夹紧过程中断裂或显著改变夹紧接头的性能。本文提出了一种增强接口可检测性的微创方法。首先,通过蚀刻去除氧化铝层。其次,将试样分别镀上铜或金。在某些情况下,应用掩模来创建十字形电镀图案。然后,将镀层试样与非镀层试样相结合,并在CT扫描中评估结合点的界面可检测性。结果表明,2.6 ~ 4 μm的镀铜层可以对部分界面进行可视化,而7 ~ 9 μm的镀铜层几乎可以连续增强对界面的可检测性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Nondestructive Evaluation
Journal of Nondestructive Evaluation 工程技术-材料科学:表征与测试
CiteScore
4.90
自引率
7.10%
发文量
67
审稿时长
9 months
期刊介绍: Journal of Nondestructive Evaluation provides a forum for the broad range of scientific and engineering activities involved in developing a quantitative nondestructive evaluation (NDE) capability. This interdisciplinary journal publishes papers on the development of new equipment, analyses, and approaches to nondestructive measurements.
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