A Through Silicon Via (TSV) Architecture of the Bumpless Build Cube (BBCube) for Stacked Memory Devices

IF 3.8 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2025-07-22 DOI:10.1109/JETCAS.2025.3591627

Shinji Sugatani;Hiroyuki Ryoson;Norio Chujo;Masao Taguchi;Koji Sakui;Takayuki Ohba

{"title":"A Through Silicon Via (TSV) Architecture of the Bumpless Build Cube (BBCube) for Stacked Memory Devices","authors":"Shinji Sugatani;Hiroyuki Ryoson;Norio Chujo;Masao Taguchi;Koji Sakui;Takayuki Ohba","doi":"10.1109/JETCAS.2025.3591627","DOIUrl":null,"url":null,"abstract":"This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, <inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>-bump technology, hybrid bonding technology, and BBCube-TSV are overviewed, addressing the detailed structures and the opportunities of applying for 3D-memories. Then, the process steps of the BBCube-TSV are summarized to figure out the key process steps. Three types of applications are reviewed to illustrate and discuss the potentiality of the BBCube-TSV to enhance 3D-memories, power delivery wiring in processor on stacked memory devices, and advantage in defect management with sophisticated ideas on stacked memories. The simplicity of the structure and the occupation of copper in the TSV structure are found to provide the advantages. The role of the TSV as a vertical interconnect in the hierarchy of multilayer wiring is discussed.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"15 3","pages":"368-378"},"PeriodicalIF":3.8000,"publicationDate":"2025-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11088080","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11088080/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs,

$\mu $

-bump technology, hybrid bonding technology, and BBCube-TSV are overviewed, addressing the detailed structures and the opportunities of applying for 3D-memories. Then, the process steps of the BBCube-TSV are summarized to figure out the key process steps. Three types of applications are reviewed to illustrate and discuss the potentiality of the BBCube-TSV to enhance 3D-memories, power delivery wiring in processor on stacked memory devices, and advantage in defect management with sophisticated ideas on stacked memories. The simplicity of the structure and the occupation of copper in the TSV structure are found to provide the advantages. The role of the TSV as a vertical interconnect in the hierarchy of multilayer wiring is discussed.

查看原文本刊更多论文

一种用于堆叠存储器器件的无碰撞构建立方体（BBCube）的TSV架构

本文介绍了一种晶圆上晶圆（WOW）通孔通孔（TSV）的架构，名为Bumpless Build Cube-TSV （BBCube-TSV）。首先，概述了三种类型的tsv， $\mu $ -bump技术，混合键合技术和BBCube-TSV，讨论了详细的结构和应用于3d存储器的机会。然后对BBCube-TSV的工艺步骤进行总结，找出关键的工艺步骤。本文回顾了三种类型的应用，以说明和讨论BBCube-TSV在增强3d存储器、堆叠存储器器件上处理器的电源传输布线以及在堆叠存储器上具有复杂思想的缺陷管理方面的优势。结构简单，不占用铜，是TSV结构的优点。讨论了TSV在多层布线层次结构中作为垂直互连的作用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

IEEE Journal on Emerging and Selected Topics in Circuits and Systems ENGINEERING, ELECTRICAL & ELECTRONIC-

CiteScore

8.50

自引率

2.20%

发文量

期刊介绍： The IEEE Journal on Emerging and Selected Topics in Circuits and Systems is published quarterly and solicits, with particular emphasis on emerging areas, special issues on topics that cover the entire scope of the IEEE Circuits and Systems (CAS) Society, namely the theory, analysis, design, tools, and implementation of circuits and systems, spanning their theoretical foundations, applications, and architectures for signal and information processing.