{"title":"Novel polyphenylene sulfide resin for high-frequency copper-clad laminates with low dielectric tangent and flame retardancy","authors":"Daisuke Ito , Keizo Inoue , Yuichi Fujioka , Teruhiko Miki , Shinsuke Ishikawa , Akihiko Happoya , Seigo Watanabe , Tomohiro Miura , Kenichi Oyaizu","doi":"10.1016/j.polymer.2025.129095","DOIUrl":null,"url":null,"abstract":"<div><div>We report a novel poly(2,6-dimethyl-1,4-phenylene sulfide) resin bearing vinyl groups (PMPS-V) designed for next-generation copper-clad laminates used in high-frequency applications. Oligo(2,6-dimethyl-1,4-phenylene ether) resins are commonly used owing to their low dielectric constant and high thermal resistance; however, further reduction in dielectric loss tangents is needed for future communication networks. Materials with excellent dielectric properties typically exhibit low polarity and high flammability, presenting a trade-off between dielectric performance and flame retardancy.</div><div>PMPS-V exhibits thermosetting behavior and an extremely low dielectric-loss tangent (<0.001 at 10 GHz). Owing to its polyphenylene sulfide backbone, PMPS-V meets the UL-94 V-0 flame retardancy standard. Long-term heat resistance testing at 150 °C confirmed minimal degradation in dielectric properties, demonstrating excellent thermal stability. In addition, PMPS-V has a high glass transition temperature and favorable solubility in common solvents such as toluene, making it suitable for printed wiring board applications. These results indicate that PMPS-V is a promising candidate for next-generation low dielectric materials.</div></div>","PeriodicalId":405,"journal":{"name":"Polymer","volume":"338 ","pages":"Article 129095"},"PeriodicalIF":4.5000,"publicationDate":"2025-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S003238612501081X","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
引用次数: 0
Abstract
We report a novel poly(2,6-dimethyl-1,4-phenylene sulfide) resin bearing vinyl groups (PMPS-V) designed for next-generation copper-clad laminates used in high-frequency applications. Oligo(2,6-dimethyl-1,4-phenylene ether) resins are commonly used owing to their low dielectric constant and high thermal resistance; however, further reduction in dielectric loss tangents is needed for future communication networks. Materials with excellent dielectric properties typically exhibit low polarity and high flammability, presenting a trade-off between dielectric performance and flame retardancy.
PMPS-V exhibits thermosetting behavior and an extremely low dielectric-loss tangent (<0.001 at 10 GHz). Owing to its polyphenylene sulfide backbone, PMPS-V meets the UL-94 V-0 flame retardancy standard. Long-term heat resistance testing at 150 °C confirmed minimal degradation in dielectric properties, demonstrating excellent thermal stability. In addition, PMPS-V has a high glass transition temperature and favorable solubility in common solvents such as toluene, making it suitable for printed wiring board applications. These results indicate that PMPS-V is a promising candidate for next-generation low dielectric materials.
期刊介绍:
Polymer is an interdisciplinary journal dedicated to publishing innovative and significant advances in Polymer Physics, Chemistry and Technology. We welcome submissions on polymer hybrids, nanocomposites, characterisation and self-assembly. Polymer also publishes work on the technological application of polymers in energy and optoelectronics.
The main scope is covered but not limited to the following core areas:
Polymer Materials
Nanocomposites and hybrid nanomaterials
Polymer blends, films, fibres, networks and porous materials
Physical Characterization
Characterisation, modelling and simulation* of molecular and materials properties in bulk, solution, and thin films
Polymer Engineering
Advanced multiscale processing methods
Polymer Synthesis, Modification and Self-assembly
Including designer polymer architectures, mechanisms and kinetics, and supramolecular polymerization
Technological Applications
Polymers for energy generation and storage
Polymer membranes for separation technology
Polymers for opto- and microelectronics.