Dong Zhang, Guang-Chao Nie, Zheng-Yan Yang, Xiao-Ming Zhang
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引用次数: 0
Abstract
The occurrence of subsurface micro-cracks during machining poses a significant challenge in manufacturing engineering, contributing to the degradation of components’ machined surface integrity. However, the process of micro-crack formation lacks direct in-situ experimental characterization, creating a gap in understanding the micro-crack initiation mechanisms on the machined subsurface. This study addresses this gap by utilizing an ultra-high-speed in-situ imaging system to capture micro-crack formation within the machined subsurface during the orthogonal cutting of nickel-based cast superalloy. The moment of crack initiation can be estimated by analyzing the displacement increment gradient between successive images. A quantitative analysis of displacement fields and accumulated strain fields during subsurface micro-crack initiation using the digital image correlation (DIC) approach has been presented. The localized tensile tangential strain on the machined subsurface before crack initiation is found to be approximately constant under various cutting parameters, and the maximum machined micro-cracks can reach around 59.7 μm in width and 158.6 μm in length. Furthermore, the observed cracking phenomenon in the machined subsurface demonstrates attributes typical of cleavage fracture, characterized by brittle cracking with low plasticity.
期刊介绍:
Precision Engineering - Journal of the International Societies for Precision Engineering and Nanotechnology is devoted to the multidisciplinary study and practice of high accuracy engineering, metrology, and manufacturing. The journal takes an integrated approach to all subjects related to research, design, manufacture, performance validation, and application of high precision machines, instruments, and components, including fundamental and applied research and development in manufacturing processes, fabrication technology, and advanced measurement science. The scope includes precision-engineered systems and supporting metrology over the full range of length scales, from atom-based nanotechnology and advanced lithographic technology to large-scale systems, including optical and radio telescopes and macrometrology.