Jing Liu , Yabin Jing , Ran Wei , Jingjing Peng , Xian Zhang , Lin Cheng , Tao Zhang
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引用次数: 0
Abstract
This study established a mechanistic model for the prediction of electrochemical migration (ECM) failure time of Ag electrode in a thin liquid film, based on electrode kinetics and diffusion dynamics. The dendrite growth processes of Ag under various bias voltages, liquid film thicknesses and Cl- concentrations were investigated. The ECM model was validated against experimental data, demonstrating the reliability of this model. Under actual packaging technology where experimental precision is insufficient (film thickness lower than 10 μm), model-based extrapolation reveals that migration resistance becomes the dominant determinant instead of volume effect, leading to a pronounced extension of ECM failure time.
期刊介绍:
Corrosion occurrence and its practical control encompass a vast array of scientific knowledge. Corrosion Science endeavors to serve as the conduit for the exchange of ideas, developments, and research across all facets of this field, encompassing both metallic and non-metallic corrosion. The scope of this international journal is broad and inclusive. Published papers span from highly theoretical inquiries to essentially practical applications, covering diverse areas such as high-temperature oxidation, passivity, anodic oxidation, biochemical corrosion, stress corrosion cracking, and corrosion control mechanisms and methodologies.
This journal publishes original papers and critical reviews across the spectrum of pure and applied corrosion, material degradation, and surface science and engineering. It serves as a crucial link connecting metallurgists, materials scientists, and researchers investigating corrosion and degradation phenomena. Join us in advancing knowledge and understanding in the vital field of corrosion science.