Position-Aware Self-Supervised Learning for Wafer Map Defect Pattern Recognition

IF 5.9 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Wei Yuan;Jinda Yan;Minghao Piao
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引用次数: 0

Abstract

Wafer map defect pattern recognition is an indispensable component of semiconductor manufacturing, providing crucial information for identifying the root causes of defects in semiconductor production. In recent years, to address the overreliance on labeled data in supervised learning approaches, some efforts have introduced the concept of self-supervised learning into wafer map defect pattern recognition. However, these studies often ignore the significant data characteristics related to the spatial location of defect clusters on the wafer map itself. To address this issue, we designed an RingDistanceConv (RDConv) module to consider the impact of two types of position information—coordinates and distances—on wafer map defect recognition and proposed the position-aware self-supervised learning framework. Our framework achieved an accuracy of 96.41% on the WM-811K dataset with eight defect classes.
晶圆图缺陷模式识别的位置感知自监督学习
晶圆图缺陷模式识别是半导体制造中不可或缺的组成部分,为识别半导体生产中缺陷的根本原因提供了重要信息。近年来,为了解决监督学习方法中对标记数据的过度依赖,一些研究将自监督学习的概念引入到晶圆图缺陷模式识别中。然而,这些研究往往忽略了与晶圆图本身缺陷簇的空间位置相关的重要数据特征。为了解决这一问题,我们设计了RingDistanceConv (RDConv)模块,考虑了两种位置信息(坐标和距离)对晶圆图缺陷识别的影响,并提出了位置感知自监督学习框架。我们的框架在包含8个缺陷类别的WM-811K数据集上实现了96.41%的准确率。
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来源期刊
IEEE Transactions on Instrumentation and Measurement
IEEE Transactions on Instrumentation and Measurement 工程技术-工程:电子与电气
CiteScore
9.00
自引率
23.20%
发文量
1294
审稿时长
3.9 months
期刊介绍: Papers are sought that address innovative solutions to the development and use of electrical and electronic instruments and equipment to measure, monitor and/or record physical phenomena for the purpose of advancing measurement science, methods, functionality and applications. The scope of these papers may encompass: (1) theory, methodology, and practice of measurement; (2) design, development and evaluation of instrumentation and measurement systems and components used in generating, acquiring, conditioning and processing signals; (3) analysis, representation, display, and preservation of the information obtained from a set of measurements; and (4) scientific and technical support to establishment and maintenance of technical standards in the field of Instrumentation and Measurement.
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