Bioinspired 3D Vermiculite/Aramid Nanocomposites for High-Performance Flexible Electrical Insulation

Abstract

Modern electronic systems are evolving toward miniaturized designs, flexible architectures, and high-power-density requirements. However, progress in developing electrical insulation materials that integrate mechanical robustness, flexibility, and thermal stability remains a critical challenge. This study introduces a novel nacre-inspired aramid-vermiculite nanopaper featuring a 3D interconnected layered network, designed for use in flexible electrical insulating applications. By embedding high-aspect-ratio vermiculite nanosheets within a three-dimensional aramid nanofiber network, we fabricated a high-strength, high-toughness electrical insulating nanopaper via a continuous sol–gel-film conversion method. The resulting nanopaper exhibits exceptional mechanical properties, achieving a tensile strength of 186 MPa, a work of fracture of 55 MJ m^–3, and a strain-to-failure of 38.6%. Furthermore, it demonstrates high dielectric strength (193 kV mm^–1) and nonflammable characteristics. The bioinspired vermiculite-based nanopaper displays superior electrical breakdown resistance and flame retardancy, highlighting its potential for advanced electrical insulation applications. The fabrication process and microstructural analysis reveal the importance of the 3D interconnected layered structure in achieving these enhanced properties.