Applications of electron channeling pattern for the determination of wafer offcut and misorientation angles

IF 2.2 3区工程技术 Q1 MICROSCOPY

Micron Pub Date : 2025-09-03 DOI:10.1016/j.micron.2025.103912

Han Han , Libor Strakoš , Clément Porret , Valérie Depauw , Tomáš Vystavěl , Olivier Richard , Marina Baryshnikova , Eva Grieten , Thomas Hantschel

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Abstract

The epitaxial growth of semiconductor multilayers often starts from monocrystalline wafers that have an offcut angle. This offcut angle is critical for tailoring the properties of epitaxial materials, making its precise control essential. This study demonstrates a novel approach to determine the wafer offcut angle based on electron channeling patterns (ECP) obtained by scanning electron microscopy. The technique involves calculating the angular distance between the zone axis and the surface normal by analyzing a series of ECP images acquired at various rotations/tilts. The method successfully applies to Si(001) substrates with different offcut angles, measured within ∼1 h with an angular accuracy of

\sim

0.05°. Additionally, the misorientation between the overlaying semiconductor crystalline films and the substrate is estimated with a precision down to ∼ 0.03º within ∼ 30 min. This performance can meet the accuracy requirements for a wide range of industrial and research applications.

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电子通道图在晶圆边角和错位角测定中的应用

半导体多层的外延生长通常从具有边缘角的单晶晶片开始。这种边切角对于定制外延材料的特性至关重要，因此其精确控制至关重要。本研究展示了一种基于扫描电子显微镜获得的电子通道图（ECP）来确定晶圆边角的新方法。该技术包括通过分析在不同旋转/倾斜下获得的一系列ECP图像来计算区域轴与表面法线之间的角距离。该方法成功地应用于具有不同边角的Si（001）衬底，测量范围为~ 1 h，角精度为~ 0.05°。此外，覆盖的半导体晶体薄膜和衬底之间的取向偏差可以在~ 30分钟内精确估计到~ 0.03º。这种性能可以满足广泛的工业和研究应用的精度要求。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Micron 工程技术-显微镜技术

CiteScore

4.30

自引率

4.20%

发文量

100

审稿时长

31 days

期刊介绍： Micron is an interdisciplinary forum for all work that involves new applications of microscopy or where advanced microscopy plays a central role. The journal will publish on the design, methods, application, practice or theory of microscopy and microanalysis, including reports on optical, electron-beam, X-ray microtomography, and scanning-probe systems. It also aims at the regular publication of review papers, short communications, as well as thematic issues on contemporary developments in microscopy and microanalysis. The journal embraces original research in which microscopy has contributed significantly to knowledge in biology, life science, nanoscience and nanotechnology, materials science and engineering.