Silicon safeguards: Open innovation as a shield against cyber risks

Q1 Economics, Econometrics and Finance
Jean-Paul Skeete , Siraj Ahmed Shaikh
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引用次数: 0

Abstract

We live in an era where semiconductors underpin global technological infrastructures. However, the increasing complexity and cybersecurity vulnerabilities within semiconductor supply chains, exposes all technology-based industries to significant, cyber risks.This paper investigates how incumbent semiconductor fabrication plants (fabs) leverage Open Innovation (OI) within their supply chain ecosystems to enhance resilience and maintain business continuity in the face of cyber risks. Through an indepth case study of semiconductor supply chains in the United States and Europe this, research explores the collaborative dynamics between fabs and third-party suppliers focusing on their role in mitigating cybersecurity risks Our findings illustrate that third party, suppliers are identified as the most significant source of cybersecurity risks within OI frameworks. OI serves not only as a driver of technological advancement but also as a defense mechanism within the Multilevel Perspective (MLP) framework This.study emphasizes the importance of proactive collaboration supply chain transparency, and the integration of security measures across all levels of the supply.chain. By aligning with the UK's National Semiconductor Strategy and the Digital.Security by Design initiative, this research offers valuable insights for both practitioners.and policymakers on the interplay between innovation security, and resilience in the.semiconductor industry.
硅保障:开放式创新作为抵御网络风险的屏障
我们生活在一个半导体支撑全球技术基础设施的时代。然而,半导体供应链中日益增加的复杂性和网络安全漏洞,使所有以技术为基础的行业面临重大的网络风险。本文研究了现有半导体制造工厂(晶圆厂)如何在其供应链生态系统中利用开放式创新(OI)来增强弹性,并在面对网络风险时保持业务连续性。本研究通过对美国和欧洲半导体供应链的深入案例研究,探讨了晶圆厂和第三方供应商之间的合作动态,重点关注他们在降低网络安全风险方面的作用。我们的研究结果表明,第三方供应商被认为是OI框架内网络安全风险的最重要来源。OI不仅可以作为技术进步的驱动力,还可以作为多层次视角(MLP)框架内的防御机制。研究强调了主动协作供应链透明度的重要性,以及供应链所有层面安全措施的集成。通过与英国国家半导体战略和数字技术保持一致。这项研究为两个实践者提供了有价值的见解。政策制定者在创新,安全,和弹性之间的相互作用。半导体行业。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Journal of Open Innovation: Technology, Market, and Complexity
Journal of Open Innovation: Technology, Market, and Complexity Economics, Econometrics and Finance-Economics, Econometrics and Finance (all)
CiteScore
11.00
自引率
0.00%
发文量
196
审稿时长
1 day
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