Zhijie Zhang , Yulong Hu , Xiangyu Li , Fengjiang Wang , Yi Li , Anil Kunwar
{"title":"Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications","authors":"Zhijie Zhang , Yulong Hu , Xiangyu Li , Fengjiang Wang , Yi Li , Anil Kunwar","doi":"10.1016/j.cis.2025.103630","DOIUrl":null,"url":null,"abstract":"<div><div>The rapid evolution of microelectronics requires materials that combine exceptional strength, ductility, and electrical conductivity for joining applications and durable lithium-ion battery anodes. Nanotwinned Cu (nt-Cu) surpasses conventional strengthening approaches, which often compromise ductility and conductivity, by using nanoscale twin boundaries to enhance both mechanical and electrical properties. This review examines the thermomechanical characteristics, fabrication methods, multiscale mechanistic insights, and technological applications of nt-Cu, bridging fundamental science with engineering practice. Using an informatics-driven approach that incorporates advanced text mining and visualization techniques, this study elucidates key trends in the structural and mechanical properties of nt-Cu, advancing its application in cutting-edge joining technologies.</div></div>","PeriodicalId":239,"journal":{"name":"Advances in Colloid and Interface Science","volume":"346 ","pages":"Article 103630"},"PeriodicalIF":19.3000,"publicationDate":"2025-08-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advances in Colloid and Interface Science","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0001868625002416","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
引用次数: 0
Abstract
The rapid evolution of microelectronics requires materials that combine exceptional strength, ductility, and electrical conductivity for joining applications and durable lithium-ion battery anodes. Nanotwinned Cu (nt-Cu) surpasses conventional strengthening approaches, which often compromise ductility and conductivity, by using nanoscale twin boundaries to enhance both mechanical and electrical properties. This review examines the thermomechanical characteristics, fabrication methods, multiscale mechanistic insights, and technological applications of nt-Cu, bridging fundamental science with engineering practice. Using an informatics-driven approach that incorporates advanced text mining and visualization techniques, this study elucidates key trends in the structural and mechanical properties of nt-Cu, advancing its application in cutting-edge joining technologies.
期刊介绍:
"Advances in Colloid and Interface Science" is an international journal that focuses on experimental and theoretical developments in interfacial and colloidal phenomena. The journal covers a wide range of disciplines including biology, chemistry, physics, and technology.
The journal accepts review articles on any topic within the scope of colloid and interface science. These articles should provide an in-depth analysis of the subject matter, offering a critical review of the current state of the field. The author's informed opinion on the topic should also be included. The manuscript should compare and contrast ideas found in the reviewed literature and address the limitations of these ideas.
Typically, the articles published in this journal are written by recognized experts in the field.