Toward Eco-Friendly CMP Process: Emerging Trends and Strategies for Reducing Environmental Footprint

Abstract

As the industry shifts toward AI and smart mobility technologies, the escalating demand for advanced semiconductors has led to significant environmental concerns. With a typical semiconductor fabrication plant (fab) consuming over 10,000 m³ of ultrapure water (UPW) daily, the environmental footprint is substantial. Chemical mechanical planarization (CMP) is the primary driver of this impact, accounting for approximately 30–40% of the total wastewater volume and consuming one-third of the UPW used by the fab. This process relies heavily on consumables such as slurries, pads, conditioners, and cleaning solutions, resulting in substantial wastewater generation, energy, and resource consumption. CMP is extremely demanding of resources, consuming large amounts of ultrapure water, and it also generates substantial wastewater and greenhouse gas emissions. In this review, we explore both established strategies and emerging trends for mitigating the environmental impacts of CMP through sustainable practices. It discusses the development of biodegradable slurries, recyclable abrasives, specialized pads, and advanced water treatment technologies. Emphasizing the role of green chemistry principles, life cycle assessment frameworks, and process optimization, this study highlights efforts to minimize the environmental footprint of semiconductor manufacturing. Despite recent progress, gaps remain, particularly in the development of sustainable CMP pads, biodegradability of slurry components, and effective wastewater management. This review suggests future research directions aimed at developing comprehensive strategies to reduce wastewater production, improve resource recovery, and enhance the overall sustainability of CMP processes. These efforts contribute to aligning technological advances in the semiconductor industry with global environmental objectives.