NFC-integrated transparent photovoltaic device for future electronics application

IF 4.9 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Sensors and Actuators A-physical Pub Date : 2025-09-01 DOI:10.1016/j.sna.2025.117025

Md Arifur Rahman Barno , Shuvaraj Ghosh , Malkeshkumar Patel , Sourov Hossain , Sanh Vo Thi , Cho Seung Hee , Yejun Seo , Sungtek Kahng , Joondong Kim

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引用次数: 0

Abstract

Near-field communication (NFC) technology involves short-range wireless communication between common electronic devices, such as smart cards, car keys, and house and office keys. NFC enables contactless data transfer, secure authentication, and power transfer through electromagnetic fields, greatly facilitating easy and convenient applications and data use. Conversely, transparent photovoltaics (TPVs), which combine visible transparency with solar energy conversion, are being developed for applications where conventional opaque solar cells are unlikely to be feasible, such as building or vehicle windows. This research proposes to combine NFC and TPV to obtain power generation and secure wireless communication in a single device, specifically on a glass substrate, using a sputtering technique. The device will facilitate future electronics to communicate using NFC and TPV cells offer the advantage of harvesting energy in the visible range and blocking harmful ultraviolet radiation from sunlight. In the fabricated NFC-integrated TPV device, an approximately 200 nm thick NFC coil (ITO/Ag) exhibited an inductance of over 2 microhenries at the resonant frequency of 13.56 MHz. This coil can successfully read NFC card and illuminate a red-light-emitting diode using wireless power. Additionally, the titanium-doped zinc oxide (Ti:ZnO) TPV shows approximately 70 % transparency with an open-circuit voltage of 305 mV under 365 nm illumination at an intensity of 38 mW/cm². By exploring innovative fabrication techniques and materials, we aim to develop a multifunctional substrate that efficiently combines functionalities such as wireless communication and power generation for battery-free security locks, energy-efficient smart windows, and other applications, thereby optimizing space utilization and promoting sustainable energy solutions.

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面向未来电子应用的nfc集成透明光伏器件

近场通信（NFC）技术是指智能卡、汽车钥匙、家庭和办公室钥匙等常用电子设备之间的短距离无线通信。NFC通过电磁场实现非接触式数据传输、安全认证和电力传输，极大地简化了应用和数据使用。相反，透明光伏电池（TPVs）结合了可见的透明度和太阳能转换，正在开发用于传统不透明太阳能电池不太可能可行的应用，例如建筑物或车辆窗户。本研究提出将NFC和TPV结合起来，使用溅射技术在单个设备上（特别是在玻璃基板上）获得发电和安全无线通信。该设备将促进未来电子设备使用NFC和TPV电池进行通信，其优点是在可见光范围内收集能量，并阻挡来自阳光的有害紫外线辐射。在制造的NFC集成TPV器件中，约200 nm厚的NFC线圈（ITO/Ag）在13.56 MHz的谐振频率下显示出超过2微亨的电感。该线圈可以成功读取NFC卡，并使用无线电源点亮红色发光二极管。此外，钛掺杂氧化锌（Ti:ZnO） TPV在365 nm照明下，在38 mW/cm2强度下，开路电压为305 mV，透明度约为70% %。通过探索创新的制造技术和材料，我们的目标是开发一种多功能基板，有效地结合无线通信和发电等功能，用于无电池安全锁，节能智能窗户和其他应用，从而优化空间利用并促进可持续能源解决方案。

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来源期刊

Sensors and Actuators A-physical 工程技术-工程：电子与电气

CiteScore

8.10

自引率

6.50%

发文量

630

审稿时长

49 days

期刊介绍： Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...