A Slot-Coupling Stacked Patches Antenna in Package for a 64-Elements W-Band Phased Array

IF 4.8 2区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Antennas and Wireless Propagation Letters Pub Date : 2025-07-04 DOI:10.1109/LAWP.2025.3585955

Yikun Wang;Lejiang Zhao;Jiazhi Ying;Kaiqiang Zhu;Houjun Sun

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引用次数: 0

Abstract

This letter proposes a compact W-band antenna-in-package design for a phased array front-end module. A slot-coupled stacked patches structure is developed to address integration challenges and enhance bandwidth limited by the thin substrate. The antenna is optimized by particle swarm optimization algorithm and manufactured by cost-effective modified semiadditive process. Experimental results from an 8 × 8 phased array module demonstrate consistent performance, including

$\pm 30^{\circ }$

beam scanning ability, low scan gain loss (

$\rm < $

2 dB), and low cross-polarization (

$\rm < $

$-$

20 dB) with a maximum measured effective isotropic radiated power (EIRP) of 54.8 dBm. This work provides a scalable and cost-effective solution for the integration of millimeter-wave phased array systems.

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用于64元w波段相控阵的槽耦合堆叠贴片封装天线

本文提出了一种用于相控阵前端模块的紧凑型w波段封装天线设计。开发了一种槽耦合堆叠贴片结构，以解决集成挑战并增强受薄衬底限制的带宽。采用粒子群优化算法对天线进行优化，并采用经济高效的改进半加性工艺制造天线。8 × 8相控阵模块的实验结果显示出了一致的性能，包括$\pm 30^{\circ}$波束扫描能力，低扫描增益损耗（$\rm < $ $2 dB）和低交叉极化（$\rm < $ $-$20 dB），最大测量有效各向同性辐射功率（EIRP）为54.8 dBm。这项工作为毫米波相控阵系统的集成提供了一种可扩展且具有成本效益的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Antennas and Wireless Propagation Letters 工程技术-电信学

CiteScore

8.00

自引率

9.50%

发文量

529

审稿时长

1.0 months

期刊介绍： IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.