High-Gain and Small-Aperture Traveling-Wave Endfire Antenna Based on DSPSL Using Phase-Reversal Technique

IF 4.8 2区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Fuhong Pang;Leilei Liu;Lei Zhu;Guo Qing Luo
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引用次数: 0

Abstract

In this letter, a high-gain small-aperture traveling-wave endfire antenna based on phase-reversal technique is proposed in the platform of double-sided parallel stripline (DSPSL). The field cancellation effect in conventional DSPSL causes a trade-off between high gain and small aperture. In this work, it is effectively broken by the introduction of phase-reversal crossover. As a result, high-gain endfire radiation at a small aperture can be achieved. The developed antenna forms a good endfire radiation property in the frequency range of 14.2 GHz to 15.6 GHz. The maximum endfire gain is measured to be 16 dBi at 15.1 GHz with a small cross-sectional aperture of only 0.15λ × 0.06λ. The simulated and measured results are found in good agreement with each other in the entire operating band. The proposed antenna has a few unique advantages—that is, high gain, small aperture, low profile, and low cost—and it is valuable for applications in advanced wireless communication.
基于相位反转技术的DSPSL高增益小孔径行波端射天线
本文在双面平行带状线(DSPSL)平台上,提出了一种基于反相技术的高增益小孔径行波端射天线。在传统的DSPSL中,场抵消效应导致了高增益和小孔径之间的权衡。在这项工作中,它有效地打破了引入反相交叉。因此,可以实现小孔径下的高增益端射辐射。该天线在14.2 GHz ~ 15.6 GHz频率范围内具有良好的端射性能。在15.1 GHz时测量到最大端射增益为16 dBi,截面孔径仅为0.15λ × 0.06λ。在整个工作频带内,模拟结果与实测结果吻合良好。该天线具有高增益、小孔径、低外形、低成本等优点,在先进的无线通信中具有应用价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
8.00
自引率
9.50%
发文量
529
审稿时长
1.0 months
期刊介绍: IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.
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