3-D-Metal-Printing Multibeam OAM-Generating Transmitarray With Dual-Layer I-Slot Grating Metasurface

IF 4.8 2区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Antennas and Wireless Propagation Letters Pub Date : 2025-07-02 DOI:10.1109/LAWP.2025.3585608

Jiayu Rao;Guanghui Xu;Xingang Ren;Zhixiang Huang

引用次数: 0

Abstract

A novel 3-D-metal-printing multibeam orbital angular momentum (OAM)-generating transmitarray with dual-layer I-slot grating metasurface in the frequency range of 19 GHz to 21 GHz is presented in this letter. The dual-layer I-slot grating metasurface is proposed to achieve 360° phase coverage with a high transmission coefficient (≥0.9). 3-D-metal-printing technology is employed to fabricate transmitarrays due to easy process and low cost. To validate the proposed design, dual-beam and four-beam OAM-generating transmitarrays of the 32 × 32 array are simulated, fabricated, and measured. The experimental results show that the proposed transmitarray design effectively generates dual-beam and four-beam OAM vortex waves. The proposed design offers promising applications in future wireless communication systems of high-temperature, space and high-power environments.

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基于双层i -槽光栅超表面的三维金属打印多波束oam生成发射阵列

本文提出了一种新型的三维金属打印多波束轨道角动量（OAM）产生发射阵列，该发射阵列具有双层i -槽光栅超表面，频率范围为19 GHz ~ 21 GHz。提出了双层i型槽光栅超表面，实现360°相位覆盖，具有高透射系数（≥0.9）。三维金属打印技术具有工艺简单、成本低等优点。为了验证所提出的设计，对32 × 32阵列的双波束和四波束产生oam的发射阵列进行了仿真、制作和测量。实验结果表明，所提出的发射阵设计能有效地产生双波束和四波束OAM涡旋波。提出的设计在未来的高温、空间和高功率环境的无线通信系统中提供了有前途的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Antennas and Wireless Propagation Letters 工程技术-电信学

CiteScore

8.00

自引率

9.50%

发文量

529

审稿时长

1.0 months

期刊介绍： IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.