{"title":"Static bending and wave propagation analyses of a flexoelectric semiconductor nanobeam incorporating antisymmetric thickness-stretch","authors":"Ziwen Guo \n (, ), Gongye Zhang \n (, ), Changwen Mi \n (, )","doi":"10.1007/s10409-024-24203-x","DOIUrl":null,"url":null,"abstract":"<div><p>We examine the electromechanical field and charge redistribution within a flexoelectric semiconductor (FS) nanobeam, accounting for bending, fundamental thickness-shear, and antisymmetric thickness-stretch deformations. The coupled governing equations include microstructure, flexoelectric, and semiconductor effects, highlighting the interplay between mechanical displacement, electric potential, and charge carriers. For applications in flexoelectronic devices, the static bending of a simply supported FS beam induced by uniform pressure and wave propagation in an unbounded FS beam are analytically addressed using the derived framework. The effects of antisymmetric thickness-stretch on mechanical displacements and electron concentration perturbation, as well as size dependence of microstructure and flexoelectric effects, are identified. An interesting finding reveals that wave frequencies of the antisymmetric thickness-stretch mode, as anticipated by the proposed model, are larger compared to those of the model neglecting flexoelectric and semiconductor effects. For the first time, the cutoff frequency of antisymmetric thickness-stretch impacted by the two features is explained mathematically. These findings are beneficial for enhancing the performance of flexoelectronic sensors and electroacoustic devices.\n</p><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":7109,"journal":{"name":"Acta Mechanica Sinica","volume":"41 12","pages":""},"PeriodicalIF":4.6000,"publicationDate":"2025-08-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Mechanica Sinica","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10409-024-24203-x","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
We examine the electromechanical field and charge redistribution within a flexoelectric semiconductor (FS) nanobeam, accounting for bending, fundamental thickness-shear, and antisymmetric thickness-stretch deformations. The coupled governing equations include microstructure, flexoelectric, and semiconductor effects, highlighting the interplay between mechanical displacement, electric potential, and charge carriers. For applications in flexoelectronic devices, the static bending of a simply supported FS beam induced by uniform pressure and wave propagation in an unbounded FS beam are analytically addressed using the derived framework. The effects of antisymmetric thickness-stretch on mechanical displacements and electron concentration perturbation, as well as size dependence of microstructure and flexoelectric effects, are identified. An interesting finding reveals that wave frequencies of the antisymmetric thickness-stretch mode, as anticipated by the proposed model, are larger compared to those of the model neglecting flexoelectric and semiconductor effects. For the first time, the cutoff frequency of antisymmetric thickness-stretch impacted by the two features is explained mathematically. These findings are beneficial for enhancing the performance of flexoelectronic sensors and electroacoustic devices.
期刊介绍:
Acta Mechanica Sinica, sponsored by the Chinese Society of Theoretical and Applied Mechanics, promotes scientific exchanges and collaboration among Chinese scientists in China and abroad. It features high quality, original papers in all aspects of mechanics and mechanical sciences.
Not only does the journal explore the classical subdivisions of theoretical and applied mechanics such as solid and fluid mechanics, it also explores recently emerging areas such as biomechanics and nanomechanics. In addition, the journal investigates analytical, computational, and experimental progresses in all areas of mechanics. Lastly, it encourages research in interdisciplinary subjects, serving as a bridge between mechanics and other branches of engineering and the sciences.
In addition to research papers, Acta Mechanica Sinica publishes reviews, notes, experimental techniques, scientific events, and other special topics of interest.
Related subjects » Classical Continuum Physics - Computational Intelligence and Complexity - Mechanics