{"title":"Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling","authors":"Huicheng Feng, Gongyue Tang, Xiaowu Zhang","doi":"10.1016/j.ijthermalsci.2025.110273","DOIUrl":null,"url":null,"abstract":"<div><div>Liquid cooling with embedded micro-pin fins is gaining increasing attention for microelectronics due to its ability to enhance heat transfer with minimal flow resistance. Various coolants have been employed in micro-pin fin cooling systems. This study investigates the cooling performance of three typical coolants, namely, deionized water, Novec 7500 (a dielectric liquid), and GaInSn (a liquid metal), applied to a chip with backside-embedded micro-pin fins under a range of operating conditions. The numerical simulation models are validated against experimental data using deionized water. The simulation results show that the cooling performance remains largely insensitive to tip clearance in the range of 0–<span><math><mrow><mn>50</mn><mspace></mspace><mi>μ</mi><mi>m</mi></mrow></math></span>, offering an advantage for integration by accommodating variations in bonding layer thickness. The pitch of micro-pin fins significantly affects the heat transfer efficiency when using deionized water and Novec 7500, but has minimal influence on GaInSn due to its superior thermal conductivity. This suggests that liquid metal-based microcoolers, such as those using GaInSn, enable simpler designs with markedly reduced flow resistance compared to conventional coolants. Additionally, GaInSn exhibits a substantially higher coefficient of performance under identical operating conditions. These findings provide valuable insights for optimizing microcooler design and coolant selection to improve thermal management in high-performance microelectronics.</div></div>","PeriodicalId":341,"journal":{"name":"International Journal of Thermal Sciences","volume":"220 ","pages":"Article 110273"},"PeriodicalIF":5.0000,"publicationDate":"2025-09-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Thermal Sciences","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1290072925005964","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0
Abstract
Liquid cooling with embedded micro-pin fins is gaining increasing attention for microelectronics due to its ability to enhance heat transfer with minimal flow resistance. Various coolants have been employed in micro-pin fin cooling systems. This study investigates the cooling performance of three typical coolants, namely, deionized water, Novec 7500 (a dielectric liquid), and GaInSn (a liquid metal), applied to a chip with backside-embedded micro-pin fins under a range of operating conditions. The numerical simulation models are validated against experimental data using deionized water. The simulation results show that the cooling performance remains largely insensitive to tip clearance in the range of 0–, offering an advantage for integration by accommodating variations in bonding layer thickness. The pitch of micro-pin fins significantly affects the heat transfer efficiency when using deionized water and Novec 7500, but has minimal influence on GaInSn due to its superior thermal conductivity. This suggests that liquid metal-based microcoolers, such as those using GaInSn, enable simpler designs with markedly reduced flow resistance compared to conventional coolants. Additionally, GaInSn exhibits a substantially higher coefficient of performance under identical operating conditions. These findings provide valuable insights for optimizing microcooler design and coolant selection to improve thermal management in high-performance microelectronics.
期刊介绍:
The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review.
The fundamental subjects considered within the scope of the journal are:
* Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow
* Forced, natural or mixed convection in reactive or non-reactive media
* Single or multi–phase fluid flow with or without phase change
* Near–and far–field radiative heat transfer
* Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...)
* Multiscale modelling
The applied research topics include:
* Heat exchangers, heat pipes, cooling processes
* Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries)
* Nano–and micro–technology for energy, space, biosystems and devices
* Heat transport analysis in advanced systems
* Impact of energy–related processes on environment, and emerging energy systems
The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.